Semiconductor device and control method thereof
AssigneesHonda Motor Co., Ltd., Tokyo Institute of Technology
InventorsKoji Sakui, Takayuki Ohba
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AssigneesHonda Motor Co., Ltd., Tokyo Institute of Technology
InventorsKoji Sakui, Takayuki Ohba
Estimating the term…
A semiconductor device according to the present invention is formed by a plurality of semiconductor chips laminated on a substrate which are connected via a through electrode penetrating in a lamination direction, in which the plurality of semiconductor chips include first semiconductor chips 104 each having memory blocks and a decoder and a second semiconductor chip having a logic circuit, the logic circuit includes one selection circuit connected to the decoder of all the first semiconductor chips 104 and configured to select addresses of a first memory block 106A that stops input/output and a second memory block 106B that performs input/output instead among the plurality of memory blocks, and the addresses of the selected first memory block 106A and the selected second memory block 106B are each common to all the first semiconductor chips.
A semiconductor device in which a plurality of semiconductor chips laminated on a substrate are electrically connected via a plurality of through electrodes penetrating in a lamination direction, wherein
Dependencies are inferred from the claim text.