Fluoropolymer stamp fabrication method
AssigneeApplied Materials, Inc.
InventorsRoman Gouk, Jean Delmas, Steven Verhaverbeke, Chintan Buch
Life of this patent
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Abstract
An imprint lithography stamp includes a stamp body having a patterned surface and formed from a fluorinated ethylene propylene copolymer. The imprint lithography stamp further includes a backing plate with a plurality of through-holes with portions of the stamp body extending into the through-holes to adhere the stamp body to the backing plate. The patterned surface of the stamp body has a plurality of protrusions extending from the stamp body, which are used to form high aspect ratio features at high processing temperatures. A mold design for forming the imprint lithography stamp and an injection molding process for forming the imprint lithography stamp are also provided.
Claims20
A method for forming a redistribution layer, comprising:
- depositing a polymer layer onto a surface of a reconstituted substrate, the reconstituted substrate comprising a plurality of devices disposed in a molding compound;
- heating the polymer layer to from about 120° C. to about 150° C.;
- and
- physically imprinting a pattern into the polymer layer with an imprint lithography stamp to form a plurality of openings therein, wherein the imprint lithography stamp comprises fluorinated ethylene propylene (FEP), the imprint lithography stamp further comprising:
- a backing plate, comprising:
- a front surface;
- and
- a backside surface opposite the front surface, wherein the backing plate has a plurality of through-holes extending from the front surface to the backside surface;
- and
- a stamp body, comprising:
- a patterned surface having a plurality of protrusions extending from the stamp body;
- and
- a back surface opposite the patterned surface, wherein the back surface contacts the front surface of the backing plate and a portion of the stamp body extends from the back surface of the stamp body into the plurality of through-holes formed in the backing plate.
A method for forming a redistribution layer, comprising:
- depositing a polymer layer onto a surface of a reconstituted substrate, the reconstituted substrate comprising a plurality of devices disposed in a molding compound, the reconstituted substrate further comprising a previously formed redistribution layer disposed on the plurality of devices.
- heating the polymer layer to from about 120° C. to about 150° C.;
- and
- physically imprinting a pattern into the polymer layer, at a pressure of less than atmospheric pressure, with an imprint lithography stamp to form a plurality of openings therein, wherein the imprint lithography stamp comprises fluorinated ethylene propylene (FEP), the imprint lithography stamp further comprising:
- a backing plate, comprising:
- a front surface;
- and
- a backside surface opposite the front surface, wherein the backing plate has a plurality of through-holes extending from the front surface to the backside surface;
- and
- a stamp body, comprising:
- a patterned surface having a plurality of protrusions extending from the stamp body;
- and
- a back surface opposite the patterned surface, wherein the back surface contacts the front surface of the backing plate and a portion of the stamp body extends from the back surface of the stamp body into the plurality of through-holes formed in the backing plate.
A method for forming a redistribution layer, comprising:
- depositing a polymer layer onto a surface of a reconstituted substrate, the reconstituted substrate comprising a plurality of devices disposed in a molding compound;
- heating the polymer layer to from about 120° C. to about 150° C.;
- and
- physically imprinting a pattern into the polymer layer with an imprint lithography stamp to form a plurality of openings therein, wherein imprinting the pattern into the polymer layer comprises exposing the polymer layer to UV radiation through the imprint lithography stamp, the imprint lithography stamp comprising fluorinated ethylene propylene (FEP), the imprint lithography stamp further comprising:
- a backing plate, comprising:
- a front surface;
- and
- a backside surface opposite the front surface, wherein the backing plate has a plurality of through-holes extending from the front surface to the backside surface;
- and
- a stamp body, comprising:
- a patterned surface having a plurality of protrusions extending from the stamp body;
- and
- a back surface opposite the patterned surface, wherein the back surface contacts the front surface of the backing plate and a portion of the stamp body extends from the back surface of the stamp body into the plurality of through-holes formed in the backing plate.
Dependencies are inferred from the claim text.