Substrate inspection device and substrate inspection method

A substrate inspection method of allowing, in a substrate inspection device including a plate-shaped member on which a substrate having devices formed thereon is placed and a probe card which is placed above the plate-shaped member to face the plate-shaped member and has multiple needle-shaped contact probes protruding toward the substrate, the plate-shaped member to approach the probe card to bring the contact probes into contact with the devices, the substrate inspection method comprising:

• placing a cylindrical first bellows configured to expand and contract and configured to suspend to surround the contact probes and placing a cylindrical second bellows configured to expand and contract and configured to suspend to surround the first bellows;
• bringing, when the plate-shaped member approaches the probe card, the first bellows and the second bellows into contact with the plate-shaped member to form a sealing space between the first bellows and the second bellows;
• and
• compressing the sealing space,
• wherein a pressure in the sealing space is determined such that a second resultant force of respective pressing forces of the first and second bellows applied to the plate-shaped member is to be larger than a first resultant force of reaction forces applied to the substrate by the contact probes.

A substrate inspection device, including a plate-shaped member on which a substrate having devices formed thereon is placed and a probe card which is placed above the plate-shaped member to face the plate-shaped member and has multiple needle-shaped contact probes protruding toward the substrate, in which the contact probes are brought into contact with the devices by allowing the plate-shaped member to approach the probe card, the substrate inspection device comprising:

• a cylindrical main bellows configured to expand and contract and configured to suspend to surround the contact probes;
• and
• multiple cylindrical auxiliary bellows configured to expand and contract and configured to be placed around the main bellows, the multiple cylindrical auxiliary bellows being spaced apart from each other along a circumference of the main bellows in a distributed manner,
• wherein when the plate-shaped member approaches the probe card, the multiple cylindrical auxiliary bellows are brought into contact with the plate-shaped member, a respective inside of each of the multiple cylindrical auxiliary bellows is individually compressed so that the multiple auxiliary bellows apply respective pressing forces to the plate-shaped member, and
• a sealing space formed between a main bellows and an auxiliary bellows is compressed, wherein a pressure in the sealing space is determined such that a second resultant force of respective pressing forces of the main bellows and the auxiliary bellows applied to the plate-shaped member is to be larger than a first resultant force of reaction forces applied to the substrate by the contact probes.