Thermal test head for an integrated circuit device

A thermal test head for an integrated circuit device including a die mounted on a substrate, the thermal test head comprising:

• a heat exchanger assembly configured to circulate a fluid therethrough;
• a contact assembly disposed below the heat exchanger assembly, the contact assembly including
• a die-contact member including a die-contact surface configured to contact the die, and
• a substrate-contact member including a substate-contact surface configured to contact the substrate;
• a thermal control assembly disposed between the heat exchanger assembly and the contact assembly, the thermal control assembly including
• a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the die-contact member, and
• one or more spacers disposed at least partially around the Peltier device, the one or more spacers being in physical contact with the opposing surfaces of the heat exchanger assembly and the die-contact member;
• and
• an inclination-adjustment device disposed above the heat exchanger assembly,
• wherein the inclination-adjustment device is configured such that a movement of the inclination-adjustment device towards the integrated circuit device causes the die-contact surface to contact the before the substrate-contact surface contacts the substrate.

A thermal test head for an integrated circuit device including a die mounted on a substrate, the thermal test head comprising:

• a heat exchanger assembly configured to circulate a fluid therethrough;
• a contact assembly disposed below the heat exchanger assembly, the contact assembly including
• a die-contact member configured to contact the die, and
• a substrate-contact member configured to contact the substrate;
• a thermal control assembly disposed between a first surface of the die-contact member and a second surface of the heat exchanger assembly, wherein the thermal control assembly includes
• a Peltier device,
• a first layer of thermal interface material disposed between, and in physical contact with, the Peltier device and the first surface of the die-contact member,
• a second layer of thermal interface material disposed between, and in physical contact with, the Peltier device and the second surface of the heat exchanger assembly, and
• one or more spacers disposed at least partially around the Peltier device, wherein the one or more spacers are in physical contact with the first surface of the die-contact member and the second surface of the heat exchanger assembly, wherein a height of the one or more spacers is substantially equal to a sum of a height of the Peltier device, a height of the first layer of thermal interface material, and a height of the second layer of thermal interface material;
• and
• an inclination-adjustment device disposed above the heat exchanger assembly, wherein the inclination-adjustment device includes
• an alignment plate disposed above the heat exchanger assembly,
• a lock plate disposed above the alignment plate,
• one or more first springs disposed between the lock plate and the alignment plate and configured to bias the lock plate away from the alignment plate, and
• one or more second springs disposed between the alignment plate and the heat exchanger assembly and configured to bias the alignment plate away from the heat exchanger assembly, wherein an effective stiffness of the one or more second springs is greater than an effective stiffness of the one or more first springs.