System and method for over-the-air (OTA) testing to detect faulty elements in an active array antenna of an extremely high frequency (EHF) wireless communication device

A method for operating an active modulated scattering probe array, comprising:

• providing a circuit board structure having a plurality of layers, wherein said plurality of layers include alternating planar layers of electrical conductors and at least one dielectric;
• providing a first plurality of probe antenna elements disposed with a first common orientation in a first array in a first one of said plurality of layers;
• providing a first plurality of electrical signal modulation circuits connected among said first plurality of probe antenna elements and disposed in a second one of said plurality of layers, wherein each of said first plurality of electrical signal modulation circuits comprises:
• first and second electrodes to receive a first bias voltage,
• a first electrical signal modulation device connected between said first and second electrodes and having a first reactance in response to said first bias voltage, and
• a first reactive circuit element connected between said first and second electrodes and having a second reactance inverse to said first reactance;
• providing a first plurality of electrical impedances disposed in said second one of said plurality of layers and connected among said first plurality of electrical signal modulation circuits;
• providing a second plurality of probe antenna elements disposed with a second common orientation in a second array in a third one of said plurality of layers;
• providing a second plurality of electrical signal modulation circuits connected among said second plurality of probe antenna elements and disposed in a fourth one of said plurality of layers, wherein each of said second plurality of electrical signal modulation circuits comprises:
• third and fourth electrodes to receive a second bias voltage,
• a second electrical signal modulation device connected between said third and fourth electrodes and having a third reactance in response to said second bias voltage, and
• a second reactive circuit element connected between said third and fourth electrodes and having a fourth reactance inverse to said third reactance;
• and
• providing a second plurality of electrical impedances disposed in said fourth one of said plurality of layer and connected among said second plurality of electrical signal modulation circuits.