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US 11,454,489 B2Granted
Sensor module with reduced size
AssigneeMINEBEA MITSUMI Inc.
InventorsToshiaki Asakawa, Shigeyuki Adachi
Life of this patent
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Abstract
A sensor module includes a substrate; a resistor formed of a-film containing Cr, CrN, and Cr2N, on one surface of the substrate; an electronic component mounted on the one surface of the substrate, to be electrically connected to the resistor; and a power source mounted on the one surface of the substrate or on another surface of the substrate, to be electrically connected to the electronic component, to supply power to the electronic component.
Claims15
A sensor module comprising:
- a substrate;
- a resistor formed of a film containing, Cr, CrN, and Cr2N, on one surface of the substrate;
- an electronic component mounted on the one surface of the substrate, to be electrically connected to the resistor;
- and
- a power source mounted on the one surface of the substrate or on another surface of the substrate, to be electrically connected to the electronic component, to supply power to the electronic component.
2 more elements
A sensor module comprising:
- a substrate;
- a resistor formed of a material containing at least one of chromium and nickel, on one surface of the substrate;
- an electronic component mounted on the one surface of the substrate, to be electrically connected to the resistor;
- and
- a power source mounted on the one surface of the substrate or on another surface of the substrate, to be electrically connected to the electronic component, to supply power to the electronic component,
- wherein the power source is arranged on a side opposite to the electronic component with an insulating layer sandwiched in-between, and
- wherein the electronic component is electrically connected to the power source via a wiring pattern provided on a side surface of the insulating layer.
4 more elements
Dependencies are inferred from the claim text.