Flat heat pipe structure
AssigneeCooler Master Co., Ltd.
InventorsLeilei Liu, Xuemei Wang
Life of this patent
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AssigneeCooler Master Co., Ltd.
InventorsLeilei Liu, Xuemei Wang
Estimating the term…
A vapor chamber having a working fluid therein, includes a first and second casing, together forming an evaporator section having a plurality of first support structures therein, a condenser section having a plurality of second support structures therein, and a vapor flow chamber extending from the evaporator section to the condenser section is provided. The evaporator section further includes a plurality of extended heat transfer structures therein, contacting a first inner surface of the evaporator section of the first casing and being perpendicular thereto. The vapor flow chamber includes as least one evaporator vapor flow area. The first inner surface, second inner surface of the first and second casings, plurality of extended heat transfer structures, and at least one of a plurality of first support structures include evenly distributed and substantially the same thickness sintered powdered wick structures thereon. The plurality of first and second support structures supports the first and second casings of the vapor chamber.
A heat dissipation device, comprising:
Dependencies are inferred from the claim text.