Polyamide moulding compound and its use and mouldings manufactured from the moulding compound

A polyamide moulding compound comprising the following components (A) to (C):

• (A) 22 to 70 wt % of a semi-crystalline copolyamide formed from the monomers (a1) to (a5):
• (a1) 20 to 37.5 mol % 1,6-hexanediamine;
• (a2) 12.5 to 25 mol % 1,3-bis(aminomethyl)cyclohexane;
• (a3) 0 to 5 mol % at least one diamine with 2 to 35 carbon atoms, differing from monomers (a1) and (a2);
• (a4) 45 to 50 mol % 1,6-hexanedioic acid;
• and
• (a5) 0 to 5 mol % at least one dicarboxylic acid with 2 to 44 carbon atoms, differing from monomer (a4);
• wherein the proportions of the monomers (a1), (a2), and (a3) are with respect to the sum of the diamines utilized and add up to 50 mol %;
• and
• wherein the proportions of the monomers (a4) and (a5) are with respect to the sum of the dicarboxylic acids utilized and add up to 50 mol %;
• and
• wherein the proportions of the monomers (a1) to (a5) add up to 100 mol %;
• (B) 30 to 70% by weight of at least one filler;
• and
• (C) 0 to 8 wt % of at least one additive;
• wherein component (C) differs from component (B), and wherein the proportion of components (A) to (C) add up to 100 wt %;
• wherein the polyamide moulding compound has a melting temperature in the range from 100 to 260° C.