Adhesive laminate film and method for manufacturing electronic device

An adhesive laminate film comprising:

• a heat-resistant resin layer;
• a flexible resin layer;
• and
• an adhesive resin layer, the flexible resin layer being between the heat-resistant resin layer and the adhesive resin layer,
• wherein a peel strength P0 between the heat-resistant resin layer and the flexible resin layer, which is based on JIS Z0237 and measured using a method described below, is equal to or more than 0.01 N/25 mm and equal to or less than 2.0 N/25 mm, and a peel strength P1 between the heat-resistant resin layer and the flexible resin layer after a thermal treatment of the adhesive laminate film at 160° C. for four hours is equal to or more than 0.05 N/25 mm and equal to or less than 1.5 N/25 mm,
• method for measuring peel strength:
• the adhesive laminate film is attached to a silicon wafer so that the adhesive resin layer comes into contact with the silicon wafer, next, the heat-resistant resin layer is peeled off from the flexible resin layer using a tensile tester in a 180-degree direction under conditions of 25° C. and a tensile rate of 300 mm/minute, and a peel strength between the heat-resistant resin layer and the flexible resin layer in N/25 mm is measured twice, and an average value of the two measurements is the peel strength.