Poly-supported copper foil
AssigneeAdvanced Copper Foil Inc.
InventorKieran Healy
Life of this patent
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Abstract
A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.
Claims6
A method of manufacturing a supported copper product, the method comprising:
- providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film;
- thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermally treating including guiding the thin copper foil and the poly-based film over respective static heating elements, wherein an amount of heat applied by the heating elements is varied based on a predetermined thickness of the thin copper foil;
- and
- attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.
Dependencies are inferred from the claim text.