Chemical mechanical polishing apparatus and methods
AssigneeApplied Materials, Inc.
InventorsRajeev Bajaj, Thomas H. Osterheld, Hung Chen, Terrance Y. Lee
Life of this patent
Estimating the term…
Abstract
A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.
Claims19
A chemical mechanical polishing apparatus, comprising:
- a platen to support a polishing pad;
- a carrier head to hold a substrate in contact with the polishing pad;
- a first slurry component supply to provide a first slurry component including an abrasive and/or etchant without an oxidizer;
- a second slurry component supply to provide a second slurry component including an oxidizer without an abrasive and without an etchant;
- and
- a dispenser including a first outlet positioned at a first radial position over the polishing pad and a second outlet positioned at a different second radial position over the polishing pad, the first outlet coupled to the first slurry component supply and the second outlet coupled to the second slurry component supply such that the first outlet is configured to distribute the first slurry component that includes abrasive and/or etchant without the oxidizer to one or more first zones on the polishing pad and the second outlet is configured to distribute the second slurry component that includes the oxidizer without an abrasive and without an etchant to one or more different second zones on the polishing pad.
A chemical mechanical polishing apparatus, comprising:
- a platen to support a polishing pad;
- a carrier head to hold a substrate in contact with the polishing pad;
- a plurality of slurry component supplies to provide a plurality of different slurry components, each respective slurry component including exactly one from i) an abrasive and/or etchant, ii) an oxidizer, or iii) a corrosion inhibitor;
- and
- a dispenser including a plurality of outlets positioned at different radial positions over the polishing pad with each outlet coupled to a different slurry component supply of the plurality of slurry component supplies such that the plurality of outlets are configured to distribute the plurality of different slurry components to a plurality of different zones on the polishing pad with each outlet dispensing exactly one from i) an abrasive and/or etchant, ii) an oxidizer, or iii) a corrosion inhibitor.
A chemical mechanical polishing apparatus, comprising:
- a platen to support a polishing pad;
- a carrier head to hold a substrate in contact with the polishing pad;
- a plurality of slurry component supplies to provide a plurality of different slurry components, each respective slurry component of the plurality of different slurry components including exactly one from i) an abrasive and/or etchant, ii) an oxidizer, or iii) a corrosion inhibitor;
- a dispenser configured to distribute the plurality of different slurry components to the polishing pad;
- and
- a controller configured to cause the dispenser to deliver the plurality of different slurry components to the polishing pad in a timed sequence with different slurry components delivered at different times with exactly one from i) an abrasive and/or etchant, ii) an oxidizer, or iii) a corrosion inhibitor being dispensed at a time.
Dependencies are inferred from the claim text.