Bonding structure
AssigneeNapra Co., Ltd.
InventorShigenobu Sekine
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Abstract
Disclosed is a bonding structure that includes an intermetallic compound crystal composed of Sn and Cu, and, an Sn alloy matrix composed of Sn and Cu, being intended for bonding a metal body or an alloy body, the intermetallic compound crystal forming an endotaxial junction with the Sn alloy matrix, and the Sn alloy matrix and/or the intermetallic compound crystal forming an epitaxial junction with the metal body or the alloy body.
Claims8
A bonding structure comprising an intermetallic compound crystal composed of Sn and Cu, and a Sn alloy matrix composed of Sn and Cu, said bonding structure configured and adapted for bonding a metal body or an alloy body,
- the intermetallic compound crystal having a monoclinic or hexagonal crystal structure and forming an endotaxial junction with the Sn alloy matrix, and
- the Sn alloy matrix and/or the intermetallic compound crystal configured to form an epitaxial junction with the metal body or the alloy body.
Dependencies are inferred from the claim text.