# US 11,452,250 B2 · Substrate inspection device that inspects application quality of adhesive > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,250 B2 - Document ID: US11452250B2 - Status: Granted - Kind: B2 - Application number: 16/535,563 - Filed: 2019-08-08 - Published: 2019-11-28 - Granted: 2022-09-20 - Earliest claimed: 2017-02-09 - Assignees: Ckd Corporation - Applicants: CKD Corporation - Inventors: Ikuo Futamura; Tsuyoshi Ohyama; Norihiko Sakaida - Web page: https://patentgrep.com/patent/US11452250B2 ## CPC - H05K 13/0817: {Monitoring of soldering processes (inspection of solder joints or of printed solder paste G01N21/95684)} - G01B 11/00: Measuring arrangements characterised by the use of optical techniques - G01N 21/956: Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} - G01N 21/95684: {Patterns showing highly reflecting parts, e.g. metallic elements} - G06T 7/0006: {using a design-rule based approach} - G06T 7/11: Region-based segmentation - H05K 1/0269: {for visual or optical inspection} - H05K 3/34: by soldering - H05K 3/341: Surface mounted components - H05K 3/3431: {Leadless components} - H05K 3/3494: Heating processes for reflow soldering - H05K 13/046: {Surface mounting (surface mounted components H05K3/341)} - H05K 13/0469: {by applying a glue or viscous material} - H05K 13/081: {Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines} - G01N 2021/95646: {Soldering} - G06T 2207/30141: Printed circuit board [PCB] - G06T 2207/30152: Solder - H05K 2203/048: Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor - H05K 2203/163: Monitoring a manufacturing process - H05K 2203/166: Alignment or registration; Control of registration - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ## Abstract A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group. ## Claims ### Claim 1 A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device comprising: a mounting table that comprises a motor and that can move the substrate placed on the mounting table in a horizontal direction; an illumination device that irradiates the solder and the adhesive on the substrate with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive and outputs the image; and a control device that is electrically connected to and controls the motor, the illumination device, and the imaging device, and that is configured to: generate: actual solder position information of a solder group that includes two or more solders and on which the electronic component is mounted based on the image, received from the imaging device, that was taken while the mounting table is moving the substrate; ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of each of the solders; and ideal adhesive inspection reference information indicating a reference inspection position and/or a reference inspection range of the adhesive, wherein the ideal solder inspection reference information and the ideal adhesive inspection reference information are based on design data or manufacturing data stored in a storage, and the adhesive has a curing temperature higher than a melting temperature of the solders, inspect each of the solders based on actual inspection reference information obtained by shifting the ideal solder inspection reference information by mounting position adjustment information, while inspecting the adhesive based on the ideal adhesive inspection reference information, and upon determining that a printing state of the solders and an application state of the adhesive do not meet a predetermined condition, output, to the component mounting machine, the actual inspection reference information and upon determining that at least one of the printing state and the application state meet the predetermined condition, output, to the component mounting machine, at least one of a printing failure signal, an application failure signal, and failed soldering signal, wherein the mounting position adjustment information indicates an amount and direction of positional misalignment of an expected mounting position information, and the expected mounting position information indicates an expected mounting position of the electronic component relative to an ideal mounting position information that indicates an ideal mounting position of the electronic component mounted on the solder group. ### Claim 2 (depends on 1) The substrate inspection device according to claim 1, wherein the adhesive is an insulating adhesive, and prior to a predetermined reflow process, the control device: calculates an area of an overlap region between each of the solders and the adhesive, and determines successful or failed soldering based on the calculated area. ### Claim 3 (depends on 2) The substrate inspection device according to claim 2, wherein the adhesive is an insulating adhesive, and prior to a predetermined reflow process, the control device: calculates an area of an overlap region between: an expected placement region of an electrode portion of the electronic component that is mounted on the solders, and the adhesive, and determines successful or failed soldering based on the calculated area. ### Claim 4 (depends on 1) The substrate inspection device according to claim 1, wherein the adhesive is an insulating adhesive, and prior to a predetermined reflow process, the control device: calculates an area of an overlap region between: an expected placement region of an electrode portion of the electronic component that is mounted on the solders, and the adhesive, and determines successful or failed soldering based on the calculated area. ### Claim 5 (depends on 1) The substrate inspection device according to claim 1, wherein the predetermined condition is that a ratio of a range occupied by a region other than an actual solder region to the actual inspection reference information exceeds a predetermined threshold. ### Claim 6 (depends on 1) The substrate inspection device according to claim 1, wherein the predetermined condition is that a ratio of a range occupied by a region other than an actual adhesive region to the ideal adhesive inspection reference information exceeds a predetermined threshold. ### Claim 7 (depends on 1) The substrate inspection device according to claim 1, wherein the predetermined condition is that an area of a region where an actual solder region overlap with an actual adhesive region exceeds a predetermined threshold. ### Claim 8 A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects a thermosetting adhesive applied on the substrate, the substrate inspection device comprising: a mounting table that comprises a motor and that can move the substrate placed on the mounting table in a horizontal direction; an illumination device that irradiates the solder and the adhesive on the substrate with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive and outputs the image; and a control device that is electrically connected to and controls the motor, the illumination device, and the imaging device, and is configured to: generate actual solder position information of a solder group that includes two or more solders and on which the electronic component is mounted based on the image, received from the imaging device, that was taken while the mounting table is moving the substrate, and ideal adhesive inspection reference information indicating a reference inspection position and/or a reference inspection range of the adhesive, wherein the ideal adhesive inspection reference information is based on design data or manufacturing data stored in a storage, and the adhesive has a curing temperature higher than a melting temperature of the solders, output, to the component mounting machine and as mounting position adjustment information, information based on an amount of positional misalignment and a direction of positional misalignment of the actual solder position information relative to ideal solder position information, and inspect the adhesive based on the ideal adhesive inspection reference information, wherein the ideal solder position information indicates a position of the solder group included in the design data or in the manufacturing data, the mounting position adjustment information indicates an amount of positional misalignment and a direction of positional misalignment of an expected mounting position information, and the expected mounting position information indicates an expected mounting position of the electronic component, relative to an ideal mounting position information indicating an ideal mounting position of the electronic component that is to be mounted on the solder group. ### Claim 9 (depends on 8) The substrate inspection device according to claim 8, wherein the adhesive is an insulating adhesive, and prior to a predetermined reflow process, the control device: calculates an area of an overlap region between each of the solders and the adhesive, and determines successful or failed soldering based on the calculated area. ### Claim 10 (depends on 9) The substrate inspection device according to claim 9, wherein the adhesive is an insulating adhesive, and prior to a predetermined reflow process, the control device: calculates an area of an overlap region between: an expected placement region of an electrode portion of the electronic component that is mounted on the solders, and the adhesive, and determines successful or failed soldering based on the calculated area. ### Claim 11 (depends on 8) The substrate inspection device according to claim 8, wherein the adhesive is an insulating adhesive, and prior to a predetermined reflow process, the control device: calculates an area of an overlap region between: an expected placement region of an electrode portion of the electronic component that is mounted on the solders, and the adhesive, and determines successful or failed soldering based on the calculated area.