# US 11,452,239 B2 · Method for enhancing boiling performance of chip surface > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,239 B2 - Document ID: US11452239B2 - Status: Granted - Kind: B2 - Application number: 16/618,181 - Filed: 2017-12-26 - Published: 2020-04-09 - Granted: 2022-09-20 - Earliest claimed: 2017-06-01 - Assignees: Sugon Dataenergy(Beijing) Co., Ltd - Applicants: Sugon Dataenergy(Beijing) Co., Ltd - Inventors: Jisheng He; Chen Wang; Peng Zhang; Hongjie Wu; Jingnan Peng; Xing Li; Zhen Sun; Xintao Cui - Web page: https://patentgrep.com/patent/US11452239B2 ## CPC - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - H05K 7/20481: {characterised by the material composition exhibiting specific thermal properties} - G06F 1/20: Cooling means - G06F 2200/201: Cooling arrangements using cooling fluid - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract The present invention relates to a method for enhancing boiling performance of chip surface comprising steps of mounting a heat pipe directly above the surface of the chip, and forming a porous structure for increasing the vaporization core on an upper surface of the heat pipe. Performing an enhancing treatment in boiling of the upper surface of the heat pipe by mounting the heat pipe directly above the chip makes a temperature field of the boiling surface uniform, increases the boiling area and vaporization core, strengthens the boiling heat transfer, and reduces the core temperature of the chip. ## Claims ### Claim 1 A method for enhancing boiling performance of chip surface, characterized in that, comprising steps of mounting a heat pipe directly above a surface of a chip; forming a porous structure for increasing a vaporization core on an upper surface of an outer wall surface of the heat pipe, the heat pipe is a flat heat pipe, and the porous structure is formed by a method of sintering metal particles, the method of sintering metal particles comprising: removing rust and grease from the upper surface of the outer wall surface of the heat pipe: applying a layer of adhesive solution including polypropylene, polyethylene, polystyrene, polyethylene terephthalate, polymethacrylic acid, acetone or xylene to the upper surface of the outer wall surface of the heat pipe; applying a metal powder evenly to the upper surface of the outer wall surface of the heat pipe to form a metal powder surface; after drying the adhesive solution, placing the heat pipe in a sintering furnace to heat to a temperature at which the metal powder surface tends to melt under protection of hydrogen, remaining the temperature for about 20 minutes to disperse and volatilize the adhesive such that the metal powder is sintered into one body and sintered on the upper surface of the outer wall surface of the heat pipe, thereby forming the porous structure, the porous structure having a thickness less than 3 mm, and a porosity of 40%-65%. ### Claim 2 (depends on 1) The method for enhancing boiling performance of chip surface according to claim 1, characterized in that, the metal particles are copper particles or copper silver plated particles. ### Claim 3 (depends on 1) The method for enhancing boiling performance of chip surface according to claim 1, characterized in that, the porous structure is directly sintered on the upper surface of the heat pipe. ### Claim 4 (depends on 1) The method for enhancing boiling performance of chip surface according to claim 1, characterized in that, the porous structure is sintered on a thin copper sheet that is welded to the upper surface of the heat pipe by a method of low temperature welding. ### Claim 5 (depends on 1) The method for enhancing boiling performance of chip surface according to claim 1, characterized in that, the porous structure is formed by a wire and mesh structure, a micro-ribbed column, a superhydrophobic surface or a foamed copper. ### Claim 6 (depends on 5) The method for enhancing boiling performance of chip surface according to claim 5, characterized in that, the porous structure is directly formed on the upper surface of the heat pipe. ### Claim 7 (depends on 5) The method for enhancing boiling performance of chip surface according to claim 5, characterized in that, the porous structure is formed on a thin copper sheet that is welded to the upper surface of the heat pipe by a method of low temperature welding. ### Claim 8 (depends on 1) The method for enhancing boiling performance of chip surface according to claim 1, characterized in that, the chip is a CPU chip. ### Claim 9 (depends on 2) The method for enhancing boiling performance of chip surface according to claim 2, characterized in that, the porous structure is directly sintered on the upper surface of the heat pipe. ### Claim 10 (depends on 2) The method for enhancing boiling performance of chip surface according to claim 2, characterized in that, the porous structure is sintered on a thin copper sheet that is welded to the upper surface of the heat pipe by a method of low temperature welding.