# US 11,452,235 B2 · Case heat dissipation structure

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- Number: US 11,452,235 B2
- Document ID: US11452235B2
- Status: Granted
- Kind: B2
- Application number: 17/133,155
- Filed: 2020-12-23
- Published: 2021-07-08
- Granted: 2022-09-20
- Earliest claimed: 2020-01-06
- Assignees: Sungrow Power Supply Co., Ltd.
- Applicants: Sungrow Power Supply Co., Ltd.
- Inventors: Shengwei Gong; Xiaolei Shi; Pengli Ai; Gaozhou Tao
- Web page: https://patentgrep.com/patent/US11452235B2

## CPC

- F28D 1/05366: {Assemblies of conduits connected to common headers, e.g. core type radiators}
- H05K 7/20254: {Cold plates transferring heat from heat source to coolant}
- F28D 1/024: {with an air driving element}
- H05K 7/20136: {Forced ventilation, e.g. by fans (H05K7/202 takes precedence)}
- H05K 7/202: {Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers}
- H05K 7/20609: {Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger}
- H05K 7/20909: {Forced ventilation, e.g. on heat dissipaters coupled to components}
- H05K 7/20927: {Liquid coolant without phase change}
- F28D 2021/0031: {Radiators for recooling a coolant of cooling systems}
- F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A case heat dissipation structure is provided, which includes a case, a heat exchange assembly and a fan assembly. The case has a first heat dissipation chamber and a second heat dissipation chamber that are communicated with each other, and multiple heat sources are mounted in the first heat dissipation chamber and the second heat dissipation chamber, a liquid inlet for cooling liquid to flow in and a liquid outlet for cooling liquid to flow out are provided on the case. The heat exchange assembly is mounted in the first heat dissipation chamber, the heat exchange assembly comprises a heat exchanger, which is arranged between the liquid inlet and the liquid outlet. The fan assembly is mounted in the first heat dissipation chamber or the second heat dissipation chamber, and is used for driving the air in the first heat dissipation chamber and the second heat dissipation chamber to circulate mutually in operation.

## Claims

### Claim 1

A case heat dissipation structure, comprising:
a case comprising an air duct and a plurality of heat dissipation chambers which are stacked and communicated with each other, wherein the heat dissipation chamber at the top layer of the case is in communication with the heat dissipation chamber at the bottom layer of the case through the air duct, heat sources are respectively mounted in each of the plurality of heat dissipation chambers, and a liquid inlet for cooling liquid to flow in and a liquid outlet for cooling liquid to flow out are provided on the case;
a heat exchange assembly, wherein the heat exchange assembly is mounted in each heat dissipation chamber or the heat exchange assembly is mounted in some of the heat dissipation chambers, each heat exchange assembly comprising a heat exchanger that is arranged between the liquid inlet and the liquid outlet and is communicated through a liquid cooling pipeline;
a fan assembly, which is mounted in at least the heat dissipation chamber of the bottom layer, wherein the fan assembly is used for driving the air in the heat dissipation chamber of the bottom layer of the case to be transported to the heat dissipation a chamber of the top layer and subjected to heat exchange treatment through the heat exchangers, and driving the air in the heat dissipation chamber at the top layer of the case to flow back to the heat dissipation chamber at the bottom layer of the case through the air duct in operation,
wherein, a plurality of liquid cooling plates or isolation plates spaced apart are mounted in the case to form the plurality of heat dissipation chambers; and
both ends of the liquid cooling plate or the isolation plate are respectively provided with an air return port.

### Claim 2 (depends on 1)

The case heat dissipation structure according to claim 1, wherein, the fan assembly is mounted on one side of each heat exchange assembly, and a relative mounting position of the heat exchange assembly and the fan assembly in two adjacent heat dissipation chambers are oppositely arranged; and
the air outlet is arranged at one end, extending along the air exhaust side direction of the fan assembly, of the liquid cooling plate or the isolation plate, and the air outlets of two adjacent liquid cooling plates or isolation plates are staggered.

### Claim 3 (depends on 2)

The case heat dissipation structure according to claim 2, wherein, the air duct is arranged at one end, far away from the air outlet direction of the liquid cooling a plate or the isolation plate at the top or bottom of the case, so as to communicate the heat dissipation chamber at the top layer of the case with the heat dissipation chamber at the bottom layer of the case.

### Claim 4 (depends on 1)

The case heat dissipation structure according to claim 1, wherein, a plurality of groups of first pipe joints and second pipe joints are mounted on the case to form a plurality of groups of liquid inlets and liquid outlets, and each heat exchanger is provided with a first communication port and a second communication port; and
each first pipe joint and the corresponding first communication port are in communication through a liquid cooling pipeline, and each second pipe joint and the corresponding second communication port are in communication through a liquid cooling pipeline.