# US 11,452,228 B2 · Driver > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,228 B2 - Document ID: US11452228B2 - Status: Granted - Kind: B2 - Application number: 17/277,292 - Filed: 2020-02-13 - Published: 2021-12-16 - Granted: 2022-09-20 - Earliest claimed: 2019-09-25 - Assignees: Mitsuba Corporation - Applicants: MITSUBA Corporation - Inventors: Takahiko Ogane; Fumiaki Koshio; Hiroyuki Hirano; Hirokazu Takada - Web page: https://patentgrep.com/patent/US11452228B2 ## CPC - H02K 11/33: Drive circuits, e.g. power electronics (H02K11/38 takes precedence) - H02M 7/48: using discharge tubes with control electrode or semiconductor devices with control electrode - H05K 5/0043: {comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing} - H05K 5/064: {sealed by potting, e.g. waterproof resin poured in a rigid casing} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/10: characterised by their shape or disposition - H10W 74/40: characterised by their materials - H10W 90/00: Package configurations - H02K 5/225: {Terminal boxes or connection arrangements (specially adapted for submersible motors H02K5/132)} - H02K 2211/03: Machines characterised by circuit boards, e.g. pcb - H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53}) - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A driver is provided. A driver (1) includes an aluminum substrate (10) to which electronic components (13) are joined, and a resin member (20) that covers the electronic components (13). The resin member (20) has a first resin portion (21) that covers the electronic components (13) and a second resin portion (22) that covers the first resin portion (21). The hardness of the first resin portion (21) is lower than the hardness of the second resin portion (22). ## Claims ### Claim 1 A driver comprising: a substrate to which an electronic component is joined; a resin member that covers the electronic component, wherein the resin member comprises a first resin portion that covers the electronic component and a second resin portion that covers the first resin portion, and a hardness of the first resin portion is lower than a hardness of the second resin portion; and a housing having a storage portion which takes a frame body as a side wall and the substrate arranged inside an inner peripheral surface of the frame body as a bottom wall, and the first resin portion and the second resin portion are filled in the storage portion., and wherein a side surface of the substrate is coated with an adhesive, which is insulating, and wherein the frame body comprises a receiving portion which projects inward from the inner peripheral surface and on which the substrate is arranged, and a groove portion which is arranged on the receiving portion along the inner peripheral surface and on which the adhesive is arranged. ### Claim 2 (depends on 1) The driver according to claim 1, wherein the receiving portion comprises a first rib that is in contact with the substrate. ### Claim 3 (depends on 2) The driver according to claim 2, wherein an end surface of the frame body on the substrate side projects further outward than an outer surface of the substrate exposed to an outside of the housing. ### Claim 4 (depends on 2) The driver according claim 2, wherein the receiving portion has a recess portion that penetrates in a substrate thickness direction of the substrate. ### Claim 5 (depends on 2) The driver according to claim 2, wherein the frame body has a different-shape portion, the substrate is arranged inside the frame body in a first state, and the different-shape portion interferes with the substrate when an attempt is made to arrange the substrate inside the frame body in a second state different from the first state. ### Claim 6 (depends on 2) The driver according to claim 2, wherein a wire used for wire bonding and covered with the first resin portion is provided as the electronic component on the substrate. ### Claim 7 (depends on 1) The driver according to claim 1, wherein an end surface of the frame body on the substrate side projects further outward than an outer surface of the substrate exposed to an outside of the housing. ### Claim 8 (depends on 7) The driver according to claim 7, wherein a step portion is arranged between the end surface of the frame body and the inner peripheral surface of the frame body. ### Claim 9 (depends on 8) The driver according claim 8, wherein the receiving portion has a recess portion that penetrates in a substrate thickness direction of the substrate. ### Claim 10 (depends on 8) The driver according to claim 8, wherein the frame body has a different-shape portion, the substrate is arranged inside the frame body in a first state, and the different-shape portion interferes with the substrate when an attempt is made to arrange the substrate inside the frame body in a second state different from the first state. ### Claim 11 (depends on 7) The driver according claim 7, wherein the receiving portion has a recess portion that penetrates in a substrate thickness direction of the substrate. ### Claim 12 (depends on 7) The driver according to claim 7, wherein the frame body has a different-shape portion, the substrate is arranged inside the frame body in a first state, and the different-shape portion interferes with the substrate when an attempt is made to arrange the substrate inside the frame body in a second state different from the first state. ### Claim 13 (depends on 1) The driver according to claim 1, wherein the receiving portion has a recess portion that penetrates in a substrate thickness direction of the substrate. ### Claim 14 (depends on 13) The driver according to claim 13, wherein the frame body has a different-shape portion, the substrate is arranged inside the frame body in a first state, and the different-shape portion interferes with the substrate when an attempt is made to arrange the substrate inside the frame body in a second state different from the first state. ### Claim 15 (depends on 1) The driver according to claim 1, wherein the frame body has a different-shape portion, the substrate is arranged inside the frame body in a first state, and the different-shape portion interferes with the substrate when an attempt is made to arrange the substrate inside the frame body in a second state different from the first state. ### Claim 16 (depends on 15) The driver according to claim 15, wherein the frame body comprises a second rib on the inner peripheral surface, the substrate has a notch portion in which the second rib is arranged, and the second rib interferes with the substrate when an attempt is made to arrange the substrate inside the frame body in the second state. ### Claim 17 (depends on 1) The driver according to claim 1, wherein a wire used for wire bonding and covered with the first resin portion is provided as the electronic component on the substrate.