# US 11,452,215 B2 · Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet

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- Number: US 11,452,215 B2
- Document ID: US11452215B2
- Status: Granted
- Kind: B2
- Application number: 17/265,925
- Filed: 2019-07-12
- Published: 2021-06-17
- Granted: 2022-09-20
- Earliest claimed: 2018-08-10
- Assignees: Nitto Denko Corporation
- Applicants: Nitto Denko Corporation
- Inventors: Ryosuke Sasaoka; Naoki Shibata; Yasunari Oyabu
- Web page: https://patentgrep.com/patent/US11452215B2

## CPC

- H05K 3/0052: {Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards}
- H05K 3/425: {characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern}
- H05K 1/02: Details
- H05K 1/142: {Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit}
- H05K 3/10: in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K 3/22: Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)}
- H05K 3/368: {parallel to each other (H05K3/361 takes precedence)}
- H05K 1/056: {the metal substrate being covered by an organic insulating layer}
- H05K 3/02: in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K 2201/0154: Polyimide
- H05K 2201/09145: Edge details
- H05K 2201/09209: Shape and layout details of conductors
- H05K 2203/0228: Cutting, sawing, milling or shearing
- H05K 2203/03: Metal processing
- H05K 2203/107: Using laser light
- H05K 2203/14: Related to the order of processing steps
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

## Claims

### Claim 1

A method for producing a wiring circuit board comprising:
a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and
a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

### Claim 2 (depends on 1)

The method for producing a wring circuit board according to claim 1, wherein
in the second step, a cutting blade is brought into contact with one surface.

### Claim 3 (depends on 2)

The method for producing a wiring circuit board according to claim 2, wherein
the support sheet includes a direct connection portion to which the joint is directly connected,
the direct connection portion has a fragile portion, and
in the second step, the fragile portion is simultaneously cut with the thin portion.

### Claim 4 (depends on 3)

The method for producing a wiring circuit board according to claim 3, wherein
the fragile portion includes a second thin portion and/or a through hole.

### Claim 5 (depends on 1)

The method for producing a wiring circuit board according to claim 1, wherein
in the second step, a laser beam is irradiated to the other surface.

### Claim 6 (depends on 1)

The method for producing a wiring circuit board according to claim 1, wherein
the wiring circuit board has a recessed portion recessed inwardly from an outer peripheral end edge when viewed in the thickness direction, and
the thin portion is disposed at the inside of the recessed portion so as to be located inwardly with respect to a phantom outer peripheral line along the outer peripheral end edge when viewed in the thickness direction.