# US 11,452,214 B2 · Printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,214 B2 - Document ID: US11452214B2 - Status: Granted - Kind: B2 - Application number: 16/335,027 - Filed: 2017-10-13 - Published: 2019-08-15 - Granted: 2022-09-20 - Earliest claimed: 2016-10-18 - Assignees: Hella GmbH & Co. KGaA - Applicants: Hella GmbH & Co. KGaA - Inventors: Ralf Stanzmann - Web page: https://patentgrep.com/patent/US11452214B2 ## CPC - H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 3/0047: {Drilling of holes} - H05K 3/0094: {Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement} - H05K 3/36: Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 3/4623: {the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence)} - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/09536: Buried plated through-holes, i.e. plated through-holes formed in a core before lamination - H05K 2201/0959: Plated through-holes or plated blind vias filled with insulating material - H05K 2203/061: of previously made multilayered subassemblies - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A printed circuit board is provided with multiple electrically conductive layers which are separated from each other by electrically non-conductive layers. At least one electrically conductive outer layer and multiple electrically conductive intermediate layers are provided. At least one electrically conductive through-connection is provided between an electrically conductive outer layer and an electrically conductive intermediate layer. The printed circuit board consists of at least one first multilayer PCB and one second multilayer PCB. The first multilayer PCB is formed from multiple electrically conductive layers and multiple electrically non-conductive layers, and the second multilayer PCB has at least one electrically conductive layer and at least one electrically non-conductive layer. The multilayer PCBs are connected to each other. The electrically conductive through-connection between a first electrically conductive outer layer and a second electrically conductive outer layer is formed from multilayer PCBs. ## Claims ### Claim 1 A printed circuit board comprising: multiple electrically conductive layers separated from each other by electrically non-conductive layers, said multiple electrically conductive layers including at least one electrically conductive outer layer and multiple electrically conductive intermediate layers; and a first electrically conductive through-connection between the at least one electrically conductive outer layer and one of the multiple electrically conductive intermediate layers, wherein the first electrically conductive through-connection includes an electrically conductive sleeve and a sealed end, wherein the printed circuit board includes at least a first multilayer PCB and a second multilayer PCB, where the first multilayer PCB and the second multilayer PCB are connected to each other via an adhesive enriched layer directly between the first multilayer PCB and the second multilayer PCB, the adhesive enriched layer comprising a filler material, wherein the first multilayer PCB is formed from multiple first ones of the electrically conductive layers including a first electrically conductive outer layer and a first electrically conductive intermediate layer, and multiple first ones of the electrically non-conductive layers, and wherein the second multilayer PCB is formed from multiple second ones of the electrically conductive layers including a second electrically conductive outer layer and a second electrically conductive intermediate layer, and at least one of the electrically non-conductive layers, wherein the first electrically conductive through-connection of the first multilayer PCB is in fluid communication with the adhesive enriched layer and the second multilayer PCB closes off the first electrically conductive through-connection directly at the adhesive enriched layer to create the sealed end, wherein the filler material of the adhesive enriched layer extends upwardly into the electrically conductive sleeve. ### Claim 2 (depends on 1) The printed circuit board in accordance with claim 1, wherein the second multilayer PCB is formed from multiple second ones of the electrically non-conductive layers. ### Claim 3 (depends on 1) The printed circuit board in accordance with claim 1, wherein the first electrically conductive through-connection is arranged in the first multilayer PCB, where the second multilayer PCB in connection with the first electrically conductive through-connection of the first multilayer PCB has no through-connection or likewise has at least one second electrically conductive through-connection. ### Claim 4 (depends on 1) The printed circuit board in accordance with claim 1, wherein the first electrically conductive through-connection is covered on the outer side of the first multilayer PCB by an electrically conductive layer as a cover. ### Claim 5 (depends on 1) The printed circuit board in accordance with claim 1, wherein the electrically conductive layer for the cover is a copper layer with a solder mask, or is a copper layer with a surface coating with a surface coating and with a solder mask. ### Claim 6 (depends on 1) The printed circuit board in accordance with claim 1, wherein the first electrically conductive through-connection is formed by drilling through the first multilayer PCB, into which the electrically conductive sleeve is inserted or formed through electroplating. ### Claim 7 (depends on 1) The printed circuit board in accordance with claim 1, wherein an electrically conductive cover, which is essentially flat, is put on the electrically conductive sleeve filled with the filler material. ### Claim 8 (depends on 7) The printed circuit board in accordance with claim 7, wherein the electrically conductive cover is put on the filler material such that electronic components are directly mounted or soldered on the electrically conductive cover. ### Claim 9 (depends on 1) The printed circuit board in accordance with claim 1, wherein the filler material is enriched with an adhesive. ### Claim 10 A method for manufacturing a printed circuit board with multiple electrically conductive layers which are separated from each other by electrically non-conductive layers, comprising the steps of: providing at least one electrically conductive outer layer and multiple electrically conductive intermediate layers,; providing at least one first electrically conductive through-connection between the at least one electrically conductive outer layer and one of the multiple electrically conductive intermediate layer, wherein the first electrically conductive through-connection includes an electrically conductive sleeve and a sealed end, providing at least a first multilayer PCB and a second multilayer PCB, where the first multilayer PCB and the second multilayer PCB are connected to each other via an adhesive enriched layer directly between the first multilayer PCB and the second multilayer PCB, the adhesive enriched layer comprising a filer material; forming the first multilayer PCB from multiple first ones of the electrically conductive layers including a first electrically conductive outer layer and a first electrically conductive intermediate layer; forming the second multilayer PCB from multiple second ones of the electrically conductive layers including a second electrically conductive outer layer and a second electrically conductive intermediate layer, and at least one of the electrically non-conductive layer; providing the adhesive enriched layer in fluid communication with the first electrically conductive through-connection of the first multilayer PCB; positioning the second PCB to close off the first electrically conductive through-connection directly at the adhesive enriched layer to creat the sealed end; and filling the electrically conductive sleeve with the filler material such that the filler material of the adhesive enriched layer extends up into the electrically conductive sleeve. ### Claim 11 (depends on 10) The method in accordance with claim 10 further comprising providing a second electrically conductive through-connection between a first outer surface of the printed circuit board and a second outer surface of the printed circuit board. ### Claim 12 (depends on 1) The printed circuit board in accordance with claim 1 further comprising a third electrically conductive through-connection between a first outer surface of the printed circuit board and a second outer surface of the printed circuit board. ### Claim 13 (depends on 1) The printed circuit board in accordance with claim 1, wherein the first electrically conductive intermediate layer is positioned in between two of the multiple electrically non-conductive layers and directly abuts the two of the multiple electrically non-conductive layers. ### Claim 14 (depends on 10) The printed circuit board in accordance with claim 10, wherein the first electrically conductive intermediate layer is positioned in between two of the multiple electrically non-conductive layers and directly abuts the two of the multiple electrically non-conductive layers. ### Claim 15 A printed circuit board comprising: multiple electrically conductive layers separated from each other by electrically non-conductive layers, said multiple electrically conductive layers including at least one electrically conductive outer layer and multiple electrically conductive intermediate layers; a first electrically conductive through-connection between the at least one electrically conductive outer layer and one of the multiple electrically conductive intermediate layer, wherein the first electrically conductive through-connection includes an electrically conductive sleeve; the printed circuit board includes at least a first multilayer PCB and a second multilayer PCB, where the first multilayer PCB and the second multilayer PCB are connected to each other; the first multilayer PCB is formed from multiple electrically conductive layers including a first electrically conductive outer layer and a first electrically conductive intermediate layer, and multiple electrically non-conductive layers; and the second multilayer PCB is formed from multiple electrically conductive layers including a second electrically conductive outer layer and a second electrically conductive intermediate layer, and at least one electrically non-conductive layer, wherein the first electrically conductive through-connection of the first multilayer PCB is in fluid communication with an adhesive enriched layer consisting of a filler material, and the adhesive enriched layer is positioned directly between the first multilayer PCB and the second multilayer PCB, wherein the electrically conductive sleeve is filled with the filler material of the adhesive enriched layer.