# US 11,452,213 B2 · Method of fabricating battery protection circuit package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,213 B2 - Document ID: US11452213B2 - Status: Granted - Kind: B2 - Application number: 17/183,500 - Filed: 2021-02-24 - Published: 2021-11-25 - Granted: 2022-09-20 - Earliest claimed: 2020-05-12 - Assignees: Itm Semiconductor Co., Ltd. - Applicants: Itm Semiconductor Co., Ltd. - Inventors: Hyuk Hwi Na; Ho Seok Hwang; Sang Hoon Ahn; Hyun Seok Lee - Web page: https://patentgrep.com/patent/US11452213B2 ## CPC - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 3/32: electrically connecting electric components or wires to printed circuits - H02H 7/18: for batteries; for accumulators - H05K 1/181: associated with surface mounted components - H05K 2201/10166: Transistor - H05K 2201/10189: Non-printed connector - H05K 2201/1028: Thin metal strips as connectors or conductors - H05K 2203/1327: Moulding over PCB locally or completely - Y02E 60/10: Energy storage using batteries - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H02H: EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS (indicating or signalling undesired working conditions G01R, e.g. G01R31/00, G08B; locating faults along lines G01R31/08; emergency protective devices H01H) - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract Provided is a method of fabricating a battery protection circuit package, the method including preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) including at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon, mounting the complex package substrate on a lead frame including at least one metal tab for connection to a battery cell, and encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal. ## Claims ### Claim 1 A method of fabricating a battery protection circuit package, the method comprising: preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) comprising at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon; mounting the complex package substrate on a lead frame comprising at least one metal tab for connection to a battery cell; encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal; further comprising attaching battery protection circuit devices onto the rigid PCB of the complex package substrate after the complex package substrate is mounted on the lead frame, and wherein the encapsulating comprises encapsulating the battery protection circuit devices with the molded part. ### Claim 2 (depends on 1) The method of claim 1, wherein the preparing of the complex package substrate comprises preparing the complex package substrate obtained by bonding the flexible PCB to an end of the rigid PCB in a sandwich structure, and wherein the encapsulating comprises encapsulating the rigid PCB with the molded part while exposing the flexible PCB. ### Claim 3 (depends on 1) The method of claim 1, wherein the mounting of the complex package substrate on the lead frame comprises bonding the rigid PCB to the lead frame while the flexible PCB is not in contact with the lead frame. ### Claim 4 (depends on 1) The method of claim 1, further comprising mounting components comprising at least one passive device, on the rigid PCB of the complex package substrate before the complex package substrate is mounted on the lead frame. ### Claim 5 (depends on 4) The method of claim 4, wherein the mounting of the components comprises mounting the components on a plurality of the complex package substrates arranged on a strip, and wherein the method further comprises separating the plurality of complex package substrates from the strip after the components are mounted. ### Claim 6 (depends on 1) The method of claim 1, further comprising performing wire bonding to connect the battery protection circuit devices to the rigid PCB, after the battery protection circuit devices are attached. ### Claim 7 (depends on 6) The method of claim 6, further comprising performing an underfill process on bonded portions of at least some of the battery protection circuit devices mounted on the rigid PCB, by using epoxy before the encapsulating. ### Claim 8 (depends on 1) The method of claim 1, wherein the lead frame and the at least one metal tab are provided as one body, and comprise copper (Cu) or nickel (Ni). ### Claim 9 (depends on 1) The method of claim 1, wherein the at least one metal tab of the lead frame comprises a pair of metal tabs spaced apart from each other in a lengthwise direction, and wherein the mounting of the complex package substrate on the lead frame comprises mounting the complex package substrate on a portion of the lead frame to place one of the pair of metal tabs outside the complex package substrate.