# US 11,452,210 B2 · Wiring substrate and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,210 B2 - Document ID: US11452210B2 - Status: Granted - Kind: B2 - Application number: 17/094,656 - Filed: 2020-11-10 - Published: 2021-05-20 - Granted: 2022-09-20 - Earliest claimed: 2019-11-15 - Assignees: Shinko Electric Industries Co., Ltd. - Applicants: Shinko Electric Industries Co., Ltd. - Inventors: Takayuki Matsumoto; Tsukasa Nakanishi; Yukinori Hatori - Web page: https://patentgrep.com/patent/US11452210B2 ## CPC - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 3/202: {using self-supporting metal foil pattern} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/181: associated with surface mounted components - H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)} - H10W 70/442: {of multiple leadframes in a single chip} - H10W 74/111: {the semiconductor body being completely enclosed} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 2201/10674: Flip chip - H10W 72/0198: {batch processes} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An embodiment is a wiring substrate that includes a first metal plate. The first metal plate includes a first electrode and a wiring, and the wiring includes a mount portion for an electronic component. The wiring substrate further includes a second metal plate. The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode. The second metal plate includes a first opening that exposes the mount portion. The first opening is large enough to accommodate the electronic component. ## Claims ### Claim 1 A wiring substrate, comprising: a first metal plate including a first electrode and a wiring, the wiring including a mount portion for an electronic component; and a second metal plate including a second electrode diffusion-bonded to an upper surface of the first electrode, wherein the second metal plate includes a first opening that exposes the mount portion, and the first opening is large enough to accommodate the electronic component; the first electrode includes a solid first body and a first projection projecting outward from a side surface of the first body and being thinner than the first body, the first projection defining a first recess in the first electrode; the second electrode includes a solid second body diffusion-bonded to an upper surface of the first body and a second projection projecting outward from a side surface of the second body and being thinner than the second body, the second projection defining a second recess in the second electrode; and the wiring substrate further comprises an insulation layer covering the electronic component and filling the first opening, the first recess, and the second recess. ### Claim 2 (depends on 1) The wiring substrate according to claim 1, wherein the first metal plate includes a first frame portion, the first frame portion supporting the first electrode and the wiring, the second metal plate includes a second frame portion supporting the second electrode, the first frame portion includes: a third recess that is thinner than the first body, and first protrusions that are spaced apart from each other at a given interval and have a same thickness as the first body, the second frame portion includes: a fourth recess that is thinner than the second body, and second protrusions that are spaced apart from each other at a given interval and have a same thickness as the second body, and the second protrusions are diffusion-bonded to upper surfaces of the first protrusions. ### Claim 3 (depends on 1) The wiring substrate according to claim 1, further comprising: a third metal plate including a third electrode diffusion-bonded to an upper surface of the second electrode, wherein the third metal plate includes a second opening that exposes the mount portion, the second opening is large enough to accommodate the electronic component, and the second opening is located above the first opening. ### Claim 4 (depends on 3) The wiring substrate according to claim 3, further comprising: the electronic component accommodated in the first opening and the second opening and mounted on the mount portion, wherein an upper surface of the third electrode includes an electrode pad exposed from the insulation layer. ### Claim 5 (depends on 4) The wiring substrate according to claim 4, wherein a side surface of the first electrode includes an outer surface located toward a peripheral edge of the wiring substrate, and the outer surface of the first electrode and a lower surface of the first electrode are exposed from the insulation layer. ### Claim 6 (depends on 5) The wiring substrate according to claim 5, further comprising: a metal layer continuously covering the outer surface of the first electrode and the lower surface of the first electrode. ### Claim 7 (depends on 1) The wiring substrate according to claim 1, further comprising: the electronic component accommodated in the first opening and mounted on the mount portion, wherein an upper surface of the second electrode includes an electrode pad exposed from the insulation layer. ### Claim 8 (depends on 7) The wiring substrate according to claim 7, wherein a side surface of the first electrode includes an outer surface located toward a peripheral edge of the wiring substrate, and the outer surface of the first electrode and a lower surface of the first electrode are exposed from the insulation layer. ### Claim 9 (depends on 8) The wiring substrate according to claim 8, further comprising: a metal layer continuously covering the outer surface of the first electrode and the lower surface of the first electrode. ### Claim 10 (depends on 1) The wiring substrate according to claim 1, wherein the first metal plate includes a connection opening extending through the first metal plate and connected to the first opening. ### Claim 11 (depends on 10) The wiring substrate according to claim 10, wherein the first opening, the connection opening, the first recess, and the second recess are connected to one another. ### Claim 12 (depends on 7) An electronic device, comprising: the wiring substrate according to claim 7; and an electronic component mounted on the upper surface of the electrode pad. ### Claim 13 (depends on 4) An electronic device, comprising: the wiring substrate according to claim 4; and an electronic component mounted on the upper surface of the electrode pad. ### Claim 14 A wiring substrate, comprising: a first metal plate including a first electrode and a wiring, the wiring including a mount portion for an electronic component; and a second metal plate including a second electrode diffusion-bonded to an upper surface of the first electrode, wherein the second metal plate includes a first opening that exposes the mount portion, and the first opening is large enough to accommodate the electronic component; the first electrode includes a solid first body; the second electrode includes a solid second body diffusion-bonded to an upper surface of the first body; the first metal plate includes a first frame portion, the first frame portion supporting the first electrode and the wiring, the second metal plate includes a second frame portion supporting the second electrode, the first frame portion includes: a first recess that is thinner than the first body, and first protrusions that are spaced apart from each other at a given interval and have a same thickness as the first body, the second frame portion includes: a second recess that is thinner than the second body, and second protrusions that are spaced apart from each other at a given interval and have a same thickness as the second body, and the second protrusions are diffusion-bonded to upper surfaces of the first protrusions. ### Claim 15 (depends on 14) The wiring substrate according to claim 14, wherein the first electrode includes a first projection projecting outward from a side surface of the first body and being thinner than the first body, and the second electrode includes a second projection projecting outward from a side surface of the second body and being thinner than the second body. ### Claim 16 (depends on 14) The wiring substrate according to claim 14, further comprising: a third metal plate including a third electrode diffusion-bonded to an upper surface of the second electrode, wherein the third metal plate includes a second opening that exposes the mount portion, the second opening is large enough to accommodate the electronic component, and the second opening is located above the first opening. ### Claim 17 (depends on 16) The wiring substrate according to claim 16, further comprising: the electronic component accommodated in the first opening and the second opening and mounted on the mount portion; and an insulation layer filling a space among the first metal plate, the second metal plate, the third metal plate, and the electronic component and covering the electronic component, wherein an upper surface of the third electrode includes an electrode pad exposed from the insulation layer. ### Claim 18 (depends on 17) The wiring substrate according to claim 17, wherein a side surface of the first electrode includes an outer surface located toward a peripheral edge of the wiring substrate, and the outer surface of the first electrode and a lower surface of the first electrode are exposed from the insulation layer. ### Claim 19 (depends on 18) The wiring substrate according to claim 18, further comprising: a metal layer continuously covering the outer surface of the first electrode and the lower surface of the first electrode. ### Claim 20 (depends on 14) The wiring substrate according to claim 14, further comprising: the electronic component accommodated in the first opening and mounted on the mount portion; and an insulation layer filling a space among the first metal plate, the second metal plate, and the electronic component and covering the electronic component, wherein an upper surface of the second electrode includes an electrode pad exposed from the insulation layer. ### Claim 21 (depends on 20) The wiring substrate according to claim 20, wherein a side surface of the first electrode includes an outer surface located toward a peripheral edge of the wiring substrate, and the outer surface of the first electrode and a lower surface of the first electrode are exposed from the insulation layer. ### Claim 22 (depends on 21) The wiring substrate according to claim 21, further comprising: a metal layer continuously covering the outer surface of the first electrode and the lower surface of the first electrode. ### Claim 23 (depends on 20) An electronic device, comprising: the wiring substrate according to claim 20; and an electronic component mounted on the upper surface of the electrode pad. ### Claim 24 (depends on 17) An electronic device, comprising: the wiring substrate according to claim 17; and an electronic component mounted on the upper surface of the electrode pad.