# US 11,452,209 B2 · Electronic component and its manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,209 B2 - Document ID: US11452209B2 - Status: Granted - Kind: B2 - Application number: 17/134,316 - Filed: 2020-12-26 - Published: 2021-07-15 - Granted: 2022-09-20 - Earliest claimed: 2020-01-10 - Assignees: TDK Corporation - Applicants: TDK Corporation - Inventors: Yuichiro Okuyama; Takeshi Oohashi; Hajime Kuwajima; Takashi Ohtsuka; Kazuhiro Yoshikawa; Kenichi Yoshida - Web page: https://patentgrep.com/patent/US11452209B2 ## CPC - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/162: {incorporating printed capacitors} - H05K 1/0298: {Multilayer circuits} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 3/4673: {Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28)} - H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} - H05K 2201/0909: Preformed cutting or breaking line - H05K 2201/09145: Edge details - H05K 2201/09163: Slotted edge - H05K 2201/10015: Non-printed capacitor - H05K 2201/10651: Component having two leads, e.g. resistor, capacitor - H05K 2203/308: Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. ## Claims ### Claim 1 An electronic component comprising: a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate, wherein each of the plurality of insulating layers has a lower surface, an upper surface, and a side surface, wherein the plurality of insulating layers are laminated such that the upper surface of lower ones of the plurality of insulating layers contacts with the lower surface of upper ones of the plurality of insulating layers, wherein the side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part, and wherein the at least one of the plurality of insulating layers has the recessed part and the projection part over an entire side periphery thereof. ### Claim 2 (depends on 1) The electronic component as claimed in claim 1, wherein side surfaces of all the plurality of insulating layers have the recessed part and the projecting part. ### Claim 3 (depends on 1) The electronic component as claimed in claim 1, wherein the side surface of the substrate and an end surface of the projecting part are flush with each other. ### Claim 4 (depends on 1) The electronic component as claimed in claim 1, wherein a projecting amount of the projecting part from the recessed part is 3 μm or more and 10 μm or less. ### Claim 5 (depends on 1) The electronic component as claimed in claim 1, wherein the electronic component functions as an LC filter. ### Claim 6 (depends on 1) The electronic component as claimed in claim 1, wherein the upper surface of a lower one of the plurality of insulating layers is exposed on the recessed part of an upper one of the plurality of insulating layers. ### Claim 7 (depends on 1) The electronic component as claimed in claim 1, further comprising a planarizing layer located between the substrate and a lowermost one of the plurality of insulating layers. ### Claim 8 (depends on 7) The electronic component as claimed in claim 7, wherein the planarizing layer comprises alumina or silicon oxide. ### Claim 9 (depends on 1) The electronic component as claimed in claim 1, wherein the plurality of insulating layers includes first and second insulating layers, and wherein a projecting amount of the projecting part from the recessed part of the first insulating layer is different from a projecting amount of the projecting part from the recessed part of the second insulating layer. ### Claim 10 (depends on 1) The electronic component as claimed in claim 1, wherein the plurality of conductive layers includes a first conductive layer having a first conductive pattern and a second conductive layer having a second conductive pattern, wherein the plurality of insulating layers includes first and second insulating layers, wherein the first conductive pattern is embedded in the first insulating layer, and wherein the second conductive pattern is embedded in the second insulating layer and connected to the first conductive pattern through an opening formed in the first insulating layer. ### Claim 11 An electronic component comprising: a substrate; a planarizing layer formed on the substrate; a first conductive layer formed on the planarizing layer; and a first insulating layer formed on the planarizing layer such that the first conductive layer is embedded in the first insulating layer, wherein a side surface of the first insulating layer has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part, such that a part of the planarizing layer is exposed on the recessed part of the first insulating layer, and wherein the substrate comprises silicon single crystal, alumina, sapphire, aluminium nitride, MgO single crystal, SrTiO3 single crystal, surface-oxidized silicon, glass, quartz, or ferrite. ### Claim 12 (depends on 11) The electronic component as claimed in claim 11, wherein the planarizing layer comprises alumina or silicon oxide. ### Claim 13 (depends on 11) The electronic component as claimed in claim 11, further comprising: a second conductive layer formed on the first insulating layer; and a second insulating layer formed on the first insulating layer such that the second conductive layer is embedded in the second insulating layer, wherein a side surface of the second insulating layer has a recessed part set back from the side surface of the substrate and a projecting part projecting from the recessed part, such that a part of an upper surface of the first insulating layer is exposed on the recessed part of the second insulating layer. ### Claim 14 (depends on 13) The electronic component as claimed in claim 13, wherein a lower surface of the second insulating layer contacts with the upper surface of the first insulating layer. ### Claim 15 An electronic component comprising: a substrate; a first conductive layer formed over the substrate; a first insulating layer formed over the substrate such that the first conductive layer is embedded in the first insulating layer; a second conductive layer formed on the first insulating layer; and a second insulating layer formed on the first insulating layer such that the second conductive layer is embedded in the second insulating layer, wherein a side surface of the first insulating layer has a first recessed part set back from a side surface of the substrate and a first projecting part projecting from the first recessed part, and wherein a side surface of the second insulating layer has a second recessed part set back from the side surface of the substrate and a second projecting part projecting from the second recessed part, and wherein a projecting amount of the first projecting part from the first recessed part of the first insulating layer is different from a projecting amount of the second projecting part from the second recessed part of the second insulating layer. ### Claim 16 (depends on 15) The electronic component as claimed in claim 15, wherein the first conductive layer has a first conductive pattern, wherein the second conductive layer has a second conductive pattern, and wherein the second conductive pattern is connected to the first conductive pattern through an opening formed in the first insulating layer.