# US 11,452,205 B2 · Ultrasonic probe, and ultrasonic transmitter-receiver system using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,205 B2 - Document ID: US11452205B2 - Status: Granted - Kind: B2 - Application number: 16/781,219 - Filed: 2020-02-04 - Published: 2020-11-12 - Granted: 2022-09-20 - Earliest claimed: 2019-05-08 - Assignees: FUJIFILM Healthcare Corporation - Applicants: Hitachi, Ltd. - Inventors: Yasuhiro Yoshimura; Akifumi Sako; Makoto Fukada; Masahiro Sato - Web page: https://patentgrep.com/patent/US11452205B2 ## CPC - G01N 29/0654: {Imaging} - H05K 1/113: {Via provided in pad; Pad over filled via} - G01N 29/04: Analysing solids (using acoustic emission techniques G01N29/14) - G01N 29/223: {Supports, positioning or alignment in fixed situation (mounting transducers per se G10K11/004)} - G01N 29/24: Probes {(transducers for acoustic waves B06B, G10K; for measuring G01H)} - H05K 1/0281: {Reinforcement details thereof} - H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions} - H05K 1/189: characterised by the use of flexible or folded printed circuits - G01N 2291/106: one or more transducer arrays - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 2201/09072: Hole or recess under component or special relationship between hole and component - H05K 2201/10083: Electromechanical or electro-acoustic component, e.g. microphone - H05K 2201/1059: Connections made by press-fit insertion - H05K 2201/2009: Reinforced areas, e.g. for a specific part of a flexible printed circuit - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board. ## Claims ### Claim 1 An ultrasonic probe comprising, a chip having a plurality of ultrasonic elements and a plurality of connecting terminals respectively connected thereto, and a flexible printed circuit having an opening for exposing the plurality of ultrasonic elements and provided with pads along the opening, respectively associated with the plurality of connecting terminals, wherein, the connecting terminals and the pads are connected by press-fitting bumps provided on the connecting terminals into via holes provided in the pads, and a first area on a surface of the flexible printed circuit, facing to a second area of the chip where no connecting terminal is formed, is provided with a stiffness reinforcement for increasing stiffness of the flexible printed circuit. ### Claim 2 (depends on 1) The ultrasonic probe according to claim 1, wherein, the stiffness reinforcement is formed in a process of forming the pads on the flexible printed circuit, and the stiffness reinforcement has the same thickness as the pad. ### Claim 3 (depends on 1) The ultrasonic probe according to claim 1, wherein, both surfaces of the flexible printed circuit are provided with the stiffness reinforcement. ### Claim 4 (depends on 1) The ultrasonic probe according to claim 1, wherein, the stiffness reinforcement being adjacent to the pads, is a dummy pad that does not contribute to a signal line. ### Claim 5 (depends on 1) The ultrasonic probe according to claim 1, wherein, the opening of the flexible printed circuit has a quadrilateral shape when viewed from the top, and the stiffness reinforcement is formed at each of four corners of the quadrilateral shape. ### Claim 6 (depends on 5) The ultrasonic probe according to claim 5, wherein, the stiffness reinforcement has a hook-like shape. ### Claim 7 (depends on 6) The ultrasonic probe according to claim 6, wherein, the stiffness reinforcement has an opening used for alignment with the chip. ### Claim 8 (depends on 1) The ultrasonic probe according to claim 1, wherein, the flexible printed circuit has a ground line for grounding, and the stiffness reinforcement is connected to the ground line. ### Claim 9 (depends on 1) The ultrasonic probe according to claim 1, wherein, the ultrasonic elements and the connecting terminals are formed on the same surface of the chip, and the flexible printed circuit is bonded to the chip in a manner that covers the top surface of the connecting terminals. ### Claim 10 (depends on 1) The ultrasonic probe according to claim 1, wherein, the connecting terminals are formed on the undersurface of the chip, with the ultrasonic elements formed on the top surface thereof, and the flexible printed circuit is bonded to the undersurface of the chip. ### Claim 11 (depends on 10) The ultrasonic probe according to claim 10, further comprising a backing material fixed on the underside of the flexible printed circuit, wherein, the backing material is positioned below the chip, through the opening of the flexible printed circuit. ### Claim 12 (depends on 11) The ultrasonic probe according to claim 11, wherein, the backing material has a level difference between an area facing the ultrasonic elements and a surrounding area thereof, on a contact surface with the flexible print circuit, and the area facing the ultrasonic elements is accommodated in the opening of the flexible printed circuit. ### Claim 13 (depends on 1) The ultrasonic probe according to claim 1, wherein, the flexible print circuit comprises bands that are bent to serve as side surfaces, with respect to the surface connected to the chip, and the ultrasonic probe further comprises an acoustic lens covering the ultrasonic elements on the chip and the side surfaces of the flexible print circuit. ### Claim 14 (depends on 1) The ultrasonic probe according to claim 1 is an ultrasonic probe of an ultrasonic diagnostic system. ### Claim 15 (depends on 1) An ultrasonic transmitter-receiver system, comprising, an ultrasonic transmitter-receiver configured to transmit an ultrasonic signal to an ultrasonic probe coming into contact with a test subject, and to receive a signal from the ultrasonic probe, and an ultrasonic image former configured to form an image of the test subject by using the signal received by the ultrasonic transmitter-receiver, wherein, the ultrasonic probe according to claim 1 is used as the ultrasonic probe.