# US 11,452,201 B2 · Electronic device and connecting component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,452,201 B2 - Document ID: US11452201B2 - Status: Granted - Kind: B2 - Application number: 17/287,140 - Filed: 2019-09-05 - Published: 2021-12-16 - Granted: 2022-09-20 - Earliest claimed: 2018-10-30 - Assignees: Sony Corporation - Applicants: Sony Corporation - Inventors: Keiichi Hirano; Akihiro Horii; Yoshiyuki Nomura; Keiji Niina; Kosuke Sakazume - Web page: https://patentgrep.com/patent/US11452201B2 ## CPC - H05K 1/0228: {Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245)} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 7/14: Mounting supporting structure in casing or on frame or rack - H05K 9/00: Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 1/0219: {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors} - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/0723: provided by an inner layer of PCB - H05K 2201/10378: Interposers - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract To provide an electronic device and a connecting component which have a shield function and which enable downsizing. The electronic device includes: a substrate having a first substrate portion and a second substrate portion that is arranged at a position facing the first substrate portion; a plurality of potential wirings which are connected to the first substrate portion and to the second substrate portion and which have an arbitrary potential; and a plurality of signal wirings which are connected to the first substrate portion and to the second substrate portion and to which a signal is supplied. The first substrate portion has a mounting region of an electronic component on a side of a surface facing the second substrate portion. The plurality of potential wirings are arranged outside of the mounting region. ## Claims ### Claim 1 An electronic device, comprising: a substrate having a first substrate portion and a second substrate portion, wherein the second substrate portion is at a position facing the first substrate portion; a connecting component between the first substrate portion and the second substrate portion, wherein the connecting component has a plurality of surfaces; a plurality of potential wirings connected to the first substrate portion and the second substrate portion, wherein the plurality of potential wirings has an arbitrary potential, the plurality of potential wirings includes a plurality of electrodes, an electrode of the plurality of electrodes is at a corner of the connecting component, and the electrode is exposed from three surfaces of the plurality of surfaces; and a plurality of signal wirings connected to the first substrate portion and the second substrate portion, wherein the plurality of signal wirings is configured to receive a specific signal, the first substrate portion has a mounting region of an electronic component on a side of a surface of the first substrate portion, and the surface of the first substrate portion faces the second substrate portion. ### Claim 2 (depends on 1) The electronic device according to claim 1, wherein the plurality of potential wirings is on an outer side of the mounting region so as to surround at least a part of the mounting region. ### Claim 3 (depends on 1) The electronic device according to claim 1, further comprising the electronic component mountable on the mounting region. ### Claim 4 (depends on 1) The electronic device according to claim 1, wherein the plurality of potential wirings is adjacent to the mounting region. ### Claim 5 (depends on 1) The electronic device according to claim 1, wherein the connecting component includes a base material with insulating properties, and the plurality of potential wirings and the plurality of signal wirings are inside the base material. ### Claim 6 (depends on 5) The electronic device according to claim 5, wherein the connecting component further includes a conductive layer inside the base material, and the conductive layer is connected to the plurality of potential wirings. ### Claim 7 (depends on 1) The electronic device according to claim 1, wherein a line width of each potential wiring of the plurality of potential wirings is wider than a line width of each signal wiring of the plurality of signal wirings. ### Claim 8 (depends on 1) The electronic device according to claim 1, further comprising a first conductive layer in the first substrate portion, wherein the first conductive layer is connected to the plurality of potential wirings. ### Claim 9 (depends on 1) The electronic device according to claim 1, further comprising a second conductive layer in the second substrate portion, wherein the second conductive layer is connected to the plurality of potential wirings. ### Claim 10 (depends on 1) The electronic device according to claim 1, wherein at least one of the first substrate portion or the second substrate portion is a rigid substrate. ### Claim 11 (depends on 1) The electronic device according to claim 1, wherein at least a part of the substrate is a flexible substrate. ### Claim 12 (depends on 1) The electronic device according to claim 1, wherein a line width of each potential wiring of the plurality of potential wirings is 90 μm or more and 110 μm or less. ### Claim 13 (depends on 1) The electronic device according to claim 1, wherein the plurality of potential wirings includes a first potential wiring and a second potential wiring, and a distance between the first potential wiring and the second potential wiring is 490 μm or more and 510 μm or less. ### Claim 14 A connecting component, comprising: a base material having a plurality of surfaces, wherein the plurality of surfaces includes at least a first surface and a second surface, the second surface is opposite to the first surface, the connecting component is to be arranged between a first substrate portion and a second substrate portion that faces the first substrate portion; a plurality of potential wirings inside the base material, wherein the plurality of potential wirings has an arbitrary potential, the plurality of potential wirings includes a plurality of electrodes, an electrode of the plurality of electrodes is at a corner of the base material, and the electrode is exposed from three surfaces of the plurality of surfaces; and a plurality of signal wirings inside the base material, wherein the plurality of signal wirings is configured to receive a specific signal, a first end of the plurality of potential wirings and a first end of the plurality of signal wirings are respectively exposed from the first surface, and a second end of the plurality of potential wirings and a second end of the plurality of signal wirings are respectively exposed from the second surface.