# US 11,452,198 B2 · Thermally insulated printed circuit board

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- Number: US 11,452,198 B2
- Document ID: US11452198B2
- Status: Granted
- Kind: B2
- Application number: 16/522,170
- Filed: 2019-07-25
- Published: 2021-01-28
- Granted: 2022-09-20
- Earliest claimed: 2019-07-25
- Assignees: BorgWarner Inc.
- Applicants: BorgWarner, Inc.
- Inventors: Lathom Alexander Louco
- Web page: https://patentgrep.com/patent/US11452198B2

## CPC

- H05K 1/0201: {Thermal arrangements, e.g. for cooling, heating or preventing overheating}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 7/1427: {Housings}
- H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB]
- H05K 2201/10507: Involving several components
- H05K 2203/1572: Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A printed circuit board (PCB) including a first side and a second side; a conductive layer within the PCB between the first side and the second side; one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer; one or more second side electrical components attached to the second side of the PCB and electrically connected to the conductive layer; and a thermally and electrically insulating dielectric layer, within the PCB between the first side electrical components and the second side electrical components, that prevents heat emitted by the first side electrical components from increasing the temperature of the second side electrical components.

## Claims

### Claim 1

A printed circuit board (PCB) comprising:
a first side and a second side;
a conductive layer within the PCB between the first side and the second side;
one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer;
one or more second side electrical components attached to the second side of the PCB and electrically connected to the conductive layer; and
a thermally and electrically insulating dielectric layer, within the PCB between the first side electrical components and the second side electrical components, that prevents heat emitted by the first side electrical components from increasing the temperature of the second side electrical components, wherein at least one of the first side electrical components vertically overlaps at least one of the second side electrical components.

### Claim 2 (depends on 1)

The PCB recited in claim 1, wherein a top surface of the first side electrical component(s) is coplanar with the first side of the PCB.

### Claim 3 (depends on 2)

The PCB recited in claim 2, further comprising a heat sink that directly abuts the first side and the top surface of the first side electrical components.

### Claim 4 (depends on 1)

The PCB recited in claim 1, further comprising, an electrically-actuated turbocharger that receives the PCB within a PCB housing.

### Claim 5 (depends on 4)

The PCB recited in claim 4, wherein the electrically-actuated turbocharger comprises a compressor and an exhaust turbine.