# US 11,451,693 B2 · Camera module and molding circuit board assembly, circuit board and application thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,451,693 B2 - Document ID: US11451693B2 - Status: Granted - Kind: B2 - Application number: 17/314,723 - Filed: 2021-05-07 - Published: 2021-08-26 - Granted: 2022-09-20 - Earliest claimed: 2017-02-04 - Assignees: Ningbo Sunny Opotech Co., Ltd. - Applicants: Ningbo Sunny Opotech Co., Ltd. - Inventors: Mingzhu Wang; Duanliang Cheng; Fengsheng Xi; Bojie Zhao; Takehiko Tanaka; Zhen Huang; Zhenyu Chen; Nan Guo - Web page: https://patentgrep.com/patent/US11451693B2 ## CPC - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H05K 1/181: associated with surface mounted components - H05K 3/303: with surface mounted components (H05K3/32 takes precedence) - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10151: Sensor - H05K 2201/10424: Frame holders - H05K 2203/1327: Moulding over PCB locally or completely - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board. ## Claims ### Claim 1 A molding circuit board assembly comprising: a protecting portion; at least one photosensitive chip; a molding base, wherein the molding base has at least one light window; and at least one circuit board, wherein the circuit board further comprises a substrate, wherein the substrate has at least one chip holding portion, at least one protecting area surrounding the chip holding portion, and at least one bonding area surrounding the protecting area, wherein the photosensitive chip is held in the chip holding portion of the substrate, wherein the protecting portion is located at least in the protecting area of the substrate for protecting the circuit board and does not cover a wire for connecting the circuit board with the photosensitive chip, and wherein the molding base is integrally bonded to the bonding area of the substrate, and the molding base surrounds the photosensitive area of the photosensitive chip such that the photosensitive area of the photosensitive chip corresponds to the light window of the molding base. ### Claim 2 (depends on 1) The molding circuit board assembly according to claim 1, wherein the protecting portion is disposed at least in the protecting area of the substrate. ### Claim 3 (depends on 1) The molding circuit board assembly according to claim 1, wherein the protecting portion is formed at least on the protecting area of the substrate. ### Claim 4 (depends on 2) The molding circuit board assembly according to claim 2, wherein the protecting portion is disposed in the protecting area and the bonding area of the substrate. ### Claim 5 (depends on 3) The molding circuit board assembly according to claim 3, wherein the protecting portion is formed on the protecting area and the bonding area of the substrate. ### Claim 6 (depends on 3) The molding circuit board assembly according to claim 3, wherein the protecting portion is formed of ink applied to the substrate. ### Claim 7 (depends on 3) The molding circuit board assembly according to claim 3, wherein the protecting portion is formed of glue applied to the substrate. ### Claim 8 (depends on 1) The molding circuit board assembly according to claim 1, wherein the protecting portion has at least one opening, and a photosensitive area of the photosensitive chip corresponds to the opening of the protecting portion. ### Claim 9 (depends on 1) The molding circuit board assembly according to claim 1, wherein the molding base is integrally bonded to a non-photosensitive area of the photosensitive chip. ### Claim 10 (depends on 1) A camera module, comprising: at least one optical lens; and at least one molding circuit board assembly according to claim 1, wherein the optical lens is held in the photosensitive path of the photosensitive chip, and the light window of the molding base forms a light through path between the photosensitive chip and the optical lens. ### Claim 11 (depends on 10) The camera module according to claim 10, further comprising at least one bracket and at least one filter element, the bracket has at least one light through hole, the filter element is attached to the bracket, the bracket is attached to the molding base, so that the filter element is held between the optical lens and the photosensitive chip by the bracket. ### Claim 12 (depends on 10) The camera module according to claim 10, wherein the camera module is applied to an electronic device including an electronic device body, and the camera module is disposed in the electronic device body. ### Claim 13 (depends on 12) The electronic device according to claim 12, wherein the electronic device body is a smart phone, a tablet computer, a personal digital assistant, an electronic paper book, an MP3/4/5, an electronic book or a calculator. ### Claim 14 A manufacturing method of a molding circuit board assembly, the manufacturing method comprising: (a) providing a substrate with a protecting portion, wherein the protecting portion is located at least in a protecting area of the substrate; (b) forming a molding base having at least one light window on a bonding area of the substrate by a molding process; and (c) conductively connecting a photosensitive chip to the substrate via the light window of the molding base to manufacture the molding circuit board assembly, wherein the protecting portion is for protecting the substrate and does not cover a wire for connecting the substrate with the photosensitive chip. ### Claim 15 (depends on 14) The manufacturing method according to claim 14, wherein in the step (a), the method further comprising the steps of: providing the substrate; and at least disposing the protecting portion in the protecting area of the substrate. ### Claim 16 (depends on 14) The manufacturing method according to claim 14, wherein in the step (a), the method further comprising the steps of: providing the substrate; and at least forming the protecting portion on the protecting area of the substrate. ### Claim 17 (depends on 16) The manufacturing method according to claim 16, wherein in the above method, the protecting portion is further formed on the bonding area of the substrate. ### Claim 18 (depends on 16) The manufacturing method according to claim 16, wherein in the step of forming the protecting portion on the protecting area of the substrate, further comprising the step of: at least applying ink to the protecting area of the substrate to form the protecting portion on the protecting area of the substrate by ink. ### Claim 19 (depends on 16) The manufacturing method according to claim 16, wherein in the step of at least forming the protecting portion on the protecting area of the substrate, further comprising the step of: at least applying glue to the protecting area of the substrate to form the protecting portion on the protecting area of the substrate by glue. ### Claim 20 (depends on 14) The manufacturing method according to claim 14, wherein in the step (b), the method further comprises the steps of: placing the substrate into a lower die; molding a upper die and the lower die in such a manner that the protecting portion is applied pressure by a light window molding block of the upper die such that the bonding area of the substrate is held in a molding space formed between the upper die and the lower die; and curing a molding material added to the molding space such that the molding material forms the molding base bonded to the bonding area of the substrate.