# US 11,451,309 B2 · Apertures with dynamically variable electromagnetic properties

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- Number: US 11,451,309 B2
- Document ID: US11451309B2
- Status: Granted
- Kind: B2
- Application number: 16/537,212
- Filed: 2019-08-09
- Published: 2021-02-11
- Granted: 2022-09-20
- Earliest claimed: 2019-08-09
- Assignees: Raytheon Company
- Applicants: Raytheon Company
- Inventors: Kyle L. Grosse; Gary A. Frazier; Catherine Trent; Ralph Korenstein
- Web page: https://patentgrep.com/patent/US11451309B2

## CPC

- H01Q 1/425: {comprising a metallic grid}
- H04B 15/02: Reducing interference from electric apparatus by means located at or near the interfering apparatus
- H01Q 1/364: {using a particular conducting material, e.g. superconductor}
- H01Q 15/002: {said selective devices being reconfigurable or tunable, e.g. using switches or diodes}
- H03H 7/0161: {Bandpass filters (H03H7/12 takes precedence)}
- H03H 9/24: Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H 2007/013: {Notch or bandstop filters}
- H03H 2210/02: Variable filter component
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H04B: TRANSMISSION
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)

## Abstract

A dynamic aperture is disclosed. A dynamic aperture includes a base layer, a conductive structure disposed on the base layer, and a layer of a material having a dynamically controllable electrical conductivity that is disposed over the base layer and the conductive structure. A transmission profile of the dynamic aperture is determined by a combination of the conductive structure and the layer of the material. The transmission profile is dynamically alterable by controlling the electrical conductivity of the layer of the material.

## Claims

### Claim 1

A dynamic aperture comprising:
a base layer;
a conductive structure disposed on the base layer; and
a layer of a metal-to-insulator transition material having a dynamically controllable electrical conductivity, the layer of the material being disposed over the base layer and the conductive structure, a transmission profile of the dynamic aperture being determined by a combination of the conductive structure and the layer of the material, and the transmission profile being dynamically alterable by controlling the electrical conductivity of the layer of the material.

### Claim 2 (depends on 1)

The dynamic aperture of claim 1 wherein the conductive structure is an electromagnetic interference shield.

### Claim 3 (depends on 2)

The dynamic aperture of claim 2 wherein the electromagnetic interference shield includes a plurality of conductive wires arranged in a two-dimensional grid.

### Claim 4 (depends on 3)

The dynamic aperture of claim 3 further comprising a controller configured to apply a control voltage to at least a subset of the plurality of conductive wires to resistively heat the subset of the plurality of conductive wires and thereby heat a surrounding portion of the metal-to-insulator transition material to alter the electrical conductivity of the surrounding portion of the metal-to-insulator transition material.

### Claim 5 (depends on 1)

The dynamic aperture of claim 1 wherein the conductive structure is a frequency selective surface.

### Claim 6 (depends on 5)

The dynamic aperture of claim 5 wherein the frequency selective surface is configured to produce a bandpass filter in the transmission profile of the dynamic aperture, and wherein at least one of a range of frequencies included in a passband of the bandpass filter and a level of transmission in the passband of the bandpass filter is adjustable by controlling the electrical conductivity of the metal-to-insulator transition material.

### Claim 7 (depends on 1)

The dynamic aperture of claim 1 further comprising a cladding layer disposed over the layer of the material.

### Claim 8 (depends on 7)

The dynamic aperture of claim 7 wherein the layer of the material is integrated with an adhesive that bonds the cladding layer and the base layer together.

### Claim 9

A dynamic aperture comprising:
a base layer;
a conductive structure disposed on the base layer; and
a layer of a material having a dynamically controllable electrical conductivity, the layer of the material being disposed over the base layer and the conductive structure, a transmission profile of the dynamic aperture being determined by a combination of the conductive structure and the layer of the material, and the transmission profile being dynamically alterable by controlling the electrical conductivity of the layer of the material, wherein the conductive structure is an electromagnetic interference shield that includes a plurality of conductive wires arranged in a two-dimensional and overlapping grid.

### Claim 10 (depends on 9)

The dynamic aperture of claim 9 wherein the material having the dynamically controllable electrical conductivity is a metal-to-insulator transition material.

### Claim 11 (depends on 9)

The dynamic aperture of claim 9 wherein the conductive structure is a frequency selective surface.