# US 11,451,251 B2 · Radio frequency module and communication device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,451,251 B2 - Document ID: US11451251B2 - Status: Granted - Kind: B2 - Application number: 17/075,710 - Filed: 2020-10-21 - Published: 2021-05-06 - Granted: 2022-09-20 - Earliest claimed: 2019-10-31 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Atsushi Horita - Web page: https://patentgrep.com/patent/US11451251B2 ## CPC - H04B 1/0458: {Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages (matching circuits in general H03H)} - H04B 1/18: Input circuits, e.g. for coupling to an antenna or a transmission line (coupling networks between antennas or lines and receivers independent of the nature of the receiver H03H) - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H04B 1/0475: {with means for limiting noise, interference or distortion (H04B1/0483 takes precedence)} - H04B 1/1018: {noise filters connected between the power supply and the receiver} - H04B 2001/0408: {with power amplifiers} - H04B: TRANSMISSION - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract A radio frequency module includes a mounting board, a low noise amplifier, a reception filter, and an input matching circuit. The low noise amplifier is mounted on the mounting board. The reception filter is connected to the low noise amplifier. The input matching circuit is provided on a signal path between the reception filter and the low noise amplifier. The input matching circuit includes at least one inductor. The reception filter is disposed on the low noise amplifier. The at least one inductor included in the input matching circuit is adjacent to the low noise amplifier such that no other circuit element is present between the low noise amplifier and the at least one inductor. ## Claims ### Claim 1 A radio frequency module, comprising: a mounting board; a low noise amplifier mounted on the mounting board; a reception filter connected to the low noise amplifier; an input matching circuit provided on a signal path between the reception filter and the low noise amplifier, the input matching circuit including at least one inductor; a first columnar electrode that connects to the low noise amplifier and extends into the mounting board in a thickness direction of the mounting board; a second columnar electrode that connects to the input matching circuit and extends into the mounting board in the thickness direction of the mounting board; and a conductive pattern that interconnects the first columnar electrode to the second columnar electrode and extends substantially parallel to a surface of the mounting board at a predetermined depth within the mounting board so as to suppress a parasitic capacitance between the low noise amplifier and the at least one inductor in the input matching circuit and corresponding noise figure of the low noise amplifier, wherein the reception filter is disposed on the low noise amplifier, and the at least one inductor included in the input matching circuit is adjacent to the low noise amplifier such that no other circuit element is present between the low noise amplifier and the at least one inductor included in the input matching circuit. ### Claim 2 (depends on 1) The radio frequency module according to claim 1, wherein the at least one inductor comprises a plurality of inductors, and among the plurality of inductors, the inductor closest to the low noise amplifier is adjacent to the low noise amplifier. ### Claim 3 (depends on 1) The radio frequency module according to claim 1, wherein the mounting board includes a first principal surface and a second principal surface on opposite sides of the mounting board, the radio frequency module further comprises an external-connection terminal on the second principal surface of the mounting board, and the low noise amplifier, the reception filter, and the at least one inductor are disposed on the second principal surface side of the mounting board. ### Claim 4 (depends on 1) The radio frequency module according to claim 1, wherein the at least one inductor is disposed on the mounting board. ### Claim 5 (depends on 1) The radio frequency module according to claim 1, wherein the at least one inductor is disposed on the low noise amplifier. ### Claim 6 (depends on 1) The radio frequency module according to claim 1, further comprising: at least one switch from among a first switch configured to switch a filter that is connected to an antenna, a second switch configured to switch a filter that is connected to the input matching circuit, and a third switch configured to switch a low noise amplifier that is connected to an output terminal, wherein the low noise amplifier and the at least one switch are included in a single chip. ### Claim 7 (depends on 1) The radio frequency module according to claim 1, wherein the reception filter is a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter. ### Claim 8 (depends on 1) The radio frequency module according to claim 1, wherein the low noise amplifier is formed using a silicon on insulator (SOI) substrate or a SiGe substrate. ### Claim 9 (depends on 1) The radio frequency module according to claim 1, wherein the at least one inductor is at least part of a surface mount component or an integrated passive device. ### Claim 10 (depends on 1) The radio frequency module according to claim 1, further comprising: a transmission filter. ### Claim 11 (depends on 1) The radio frequency module according to claim 1, further comprising: a power amplifier configured to amplify a transmit signal. ### Claim 12 (depends on 11) The radio frequency module according to claim 11, wherein the power amplifier is mounted to a same side of the mounting board as the low noise amplifier. ### Claim 13 A communication device, comprising: the radio frequency module; and a signal processing circuit configured to process a reception signal from the radio frequency module, wherein the radio frequency module comprising a mounting board, a low noise amplifier mounted on the mounting board, a reception filter connected to the low noise amplifier, an input matching circuit provided on a signal path between the reception filter and the low noise amplifier, the input matching circuit including at least one inductor, a first columnar electrode that connects to the low noise amplifier and extends into the mounting board in a thickness direction of the mounting board, a second columnar electrode that connects to the input matching circuit and extends into the mounting board in the thickness direction of the mounting board, and a conductive pattern that interconnects the first columnar electrode to the second columnar electrode and extends substantially parallel to a surface of the mounting board at a predetermined depth within the mounting board so as to suppress a parasitic capacitance between the low noise amplifier and the at least one inductor in the input matching circuit and corresponding noise figure of the low noise amplifier, wherein the reception filter is disposed on the low noise amplifier, and the at least one inductor included in the input matching circuit is adjacent to the low noise amplifier such that no other circuit element is present between the low noise amplifier and the at least one inductor included in the input matching circuit. ### Claim 14 (depends on 13) The communication device according to claim 13, wherein the at least one inductor comprises a plurality of inductors, and among the plurality of inductors, the inductor closest to the low noise amplifier is adjacent to the low noise amplifier. ### Claim 15 (depends on 13) The communication device according to claim 13, wherein the mounting board includes a first principal surface and a second principal surface on opposite sides of the mounting board, the radio frequency module further comprises an external-connection terminal on the second principal surface of the mounting board, and the low noise amplifier, the reception filter, and the at least one inductor are disposed on the second principal surface side of the mounting board. ### Claim 16 (depends on 13) The communication device according to claim 13, wherein the at least one inductor is disposed on the mounting board. ### Claim 17 (depends on 13) The communication device according to claim 13, wherein the at least one inductor is disposed on the low noise amplifier. ### Claim 18 (depends on 13) The communication device according to claim 13, wherein the radio frequency module further comprising: at least one switch from among a first switch configured to switch a filter that is connected to an antenna, a second switch configured to switch a filter that is connected to the input matching circuit, and a third switch configured to switch a low noise amplifier that is connected to an output terminal, wherein the low noise amplifier and the at least one switch are included in a single chip. ### Claim 19 (depends on 13) The communication device according to claim 13, wherein the reception filter is a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter. ### Claim 20 (depends on 13) The communication device according to claim 13, wherein the low noise amplifier is formed using a silicon on insulator (SOI) substrate or a SiGe substrate.