Soldering a conductor to an aluminum metallization
AssigneeInfineon Technologies AG
InventorsEdmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss
Life of this patent
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Abstract
A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.
Claims15
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a flux material to an aluminum oxide layer on the aluminum metallization, wherein the flux material is a mixture of at least flux and zeolite, the flux material having a chemical composition in percent by weight of x % wt≤zoelite ≤10% wt, with x=0.01, 0.1, 0.5, 1.0, 2.0, 4.0, 6.0, or 8.0;
- disposing a solder material over the aluminum metallization, wherein the solder material has a chemical composition in percent by weight of x % wt≤Zn≤100% wt, with x=10, 30, 50, 70, 90, 95, or 100;
- and
- soldering the conductor to the aluminum metallization.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a flux material to an aluminum oxide layer on the aluminum metallization,
- disposing a solder material over the aluminum metallization, wherein the solder material has a chemical composition in percent by weight of x % wt≤Zn≤100% wt, with x=10, 30, 50, 70, 90, 95, or 100;
- and
- soldering the conductor to the aluminum metallization,
- wherein the flux material is a mixture of at least flux and crown ether, the flux material having a chemical composition in percent by weight of x % wt≤crown ether ≤50% wt, with x=0.01, 0.1, 0.5, 1, 5, 10, 20, 30, or 40.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a flux material to an aluminum oxide layer on the aluminum metallization,
- disposing a solder material over the aluminum metallization, wherein the solder material has a chemical composition in percent by weight of x % wt≤Zn≤100% wt, with x=10, 30, 50, 70, 90, 95, or 100;
- and
- soldering the conductor to the aluminum metallization,
- wherein the flux material is a mixture of at least flux, silicate, and crown ether, the flux material having a chemical composition in percent by weight of 0.01% wt≤silicate ≤10% wt and of 0.01% wt≤crown ether ≤50% wt.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a flux material to an aluminum oxide layer on the aluminum metallization,
- disposing a solder material over the aluminum metallization, wherein the solder material has a chemical composition in percent by weight of x % wt≤Zn≤100% wt, with x=10, 30, 50, 70, 90, 95, or 100;
- and
- soldering the conductor to the aluminum metallization,
- wherein the flux material is a mixture of at least flux, zeolite, and crown ether, the flux material having a chemical composition in percent by weight of 0.01% wt≤silicate ≤10% wt and of 0.01% wt≤crown ether ≤50% wt.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a flux material to an aluminum oxide layer on the aluminum metallization wherein the flux material is a mixture of at least flux and zeolite, the flux material having a chemical composition in percent by weight of 0.01% wt≤zoelite ≤10% wt.;
- disposing a solder material over the aluminum metallization, wherein the solder material has a chemical composition in percent by weight of 10% wt≤Zn≤100% wt;
- and
- soldering the conductor to the aluminum metallization.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a flux material to an aluminum oxide layer on the aluminum metallization,
- disposing a solder material over the aluminum metallization, wherein the solder material has a chemical composition in percent by weight of 10% wt≤Zn≤100% wt;
- and
- soldering the conductor to the aluminum metallization,
- wherein the flux material is a mixture of at least flux and crown ether, the flux material having a chemical composition in percent by weight of 0.01% wt≤crown ether ≤50% wt.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- applying a flux material to an aluminum oxide layer on the aluminum metallization wherein the flux material is a mixture of at least flux and crown ether, the flux material having a chemical composition in percent by weight of 0.01% wt≤crown ether ≤50% wt.;
- disposing a solder material over the aluminum metallization, wherein the solder material comprises Zn and Al;
- and
- soldering the conductor to the aluminum metallization.
Dependencies are inferred from the claim text.