Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device

An electronic module comprising:

• an electronic device in which a first substrate and a second substrate have been joined;
• and
• a package member,
• wherein the first substrate includes a front surface on a side of the second substrate, a back surface on an opposite side of the front surface, and a side surface between an edge portion of the front surface and an edge portion of the back surface,
• wherein the second substrate includes a first main surface on a side of the first substrate, a second main surface on an opposite side of the first main surface, and a side surface between an edge portion of the first main surface and an edge portion of the second main surface,
• wherein the package member includes a first portion that includes an opening and a second portion that is arranged at a position which that does not overlap the opening, and
• wherein a portion of the second substrate is positioned between the opening and a first region of the first substrate,
• wherein another portion of the second substrate is positioned between the first portion and a second region of the first substrate,
• wherein the side surface of the first substrate is in contact with the second portion, and
• wherein the side surface of the second substrate is spaced apart from the package member.

An electronic module comprising:

• a package member;
• and
• an electronic device that includes a silicon substrate and a glass substrate,
• wherein the silicon substrate includes a front surface on which a plurality of electronic elements are arranged, a back surface on an opposite side of the front surface, and a side surface between an edge portion of the front surface and an edge portion of the back surface,
• wherein the package member includes a first portion that includes an opening and a second portion that is arranged at a position that does not overlap the opening,
• wherein a first region of the silicon substrate overlaps the opening,
• wherein a second region of the silicon substrate overlaps the first portion,
• wherein a distance between the front surface and the first portion is smaller than a distance between the back surface and the first portion, and
• wherein the side surface of the silicon substrate is in contact with the second portion.