US 11,448,827 B2 · Wafer-level optoelectronic packaging

Abstract

A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer. The pre-singulated wafer has a plurality of sub-mounts. A first sub-mount of the plurality of sub-mounts includes an optical waveguide formed on a substrate, a multi-layered sub-mount boundary wall that is formed on the optical waveguide, and a v-groove that is external to the sub-mount boundary wall. A plurality of optical dies are attached to the corresponding plurality of sub-mounts, such that each optical die is aligned to the optical waveguide of the corresponding sub-mount. A cap-wafer including a plurality of caps is attached to the pre-singulated wafer to obtain an encapsulated pre-singulated wafer. The encapsulated pre-singulated wafer is diced to obtain a plurality of optoelectronic packages. The optical waveguide of each optoelectronic package serves as an interconnection conduit between the corresponding optical die and an optical fiber placed in the corresponding v-groove.

Claims16

Dependent claims

A method comprising:

forming a layer stack comprising a lower cladding layer, a core layer and an upper cladding layer;
patterning the layer stack to form a waveguide and a boundary wall,
wherein the waveguide and the boundary wall are configured to form an enclosed boundary that encloses an end portion of the waveguide;
forming a first dielectric layer on the enclosed boundary;
forming a first metal layer on portions of the first dielectric layer, wherein the first metal layer comprises a wiring trace running across the enclosed boundary;
forming a second dielectric layer having a first portion on the first metal layer and a second portion on the first dielectric layer;
and
forming a second metal layer on the second dielectric layer;
attaching an optical die, wherein the optical die is surrounded by the enclosed boundary;
and
forming a cap, wherein the cap is attached to the enclosed boundary to form a cavity for fully enclosing the optical die.

8 more elements

A method for wafer-level optoelectronic packaging, the method comprising:

providing a first substrate;
forming a layer stack comprising a lower cladding layer, a core layer and an upper cladding layer on the first substrate;
patterning the layer stack to form multiple waveguides and multiple boundary walls,
wherein a waveguide of the multiple waveguides and a boundary wall of the multiple boundary walls are configured to form an enclosed boundary that encloses an end portion of the waveguide;
forming a first dielectric layer on the enclosed boundary;
forming a first metal layer on portions of the first dielectric layer, wherein the first metal layer comprises a wiring trace running across the enclosed boundary;
forming a second dielectric layer having a first portion on the first metal layer and a second portion on the first dielectric layer;
forming a second metal layer on the second dielectric layer;
attaching an optical die of multiple optical dies on the first substrate, wherein the optical die is surrounded by the enclosed boundary;
providing a second substrate;
patterning the second substrate to form multiple caps;
attaching the second substrate to the first substrate, wherein a cap of the multiple caps is attached to the enclosed boundary to form a cavity for fully enclosing the optical die;
dicing the first and second substrates to obtain a plurality of optoelectronic packages, wherein an optoelectronic package of the plurality of optoelectronic packages comprises the optical die enclosed within the cavity formed by the cap and the enclosed boundary.

10 more elements

Dependencies are inferred from the claim text.

Wafer-level optoelectronic packaging

Life of this patent

Wafer-level optoelectronic packaging

Life of this patent

Abstract

Claims16