Back to results
US 11,448,694 B2Granted
Semiconductor package test apparatus
AssigneeSemes Co., Ltd.
InventorsEung Su Kim, Chang Taek Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.
Claims13
A semiconductor package test apparatus comprising:
- a push block configured to press semiconductor package toward an interface board for electrically connecting the semiconductor device package to a tester to bring external terminals of the semiconductor package into contact with connection terminals of the interface board;
- an insert member having a pocket receiving the semiconductor package so that the external terminals of the semiconductor package are exposed toward the interface board;
- a test tray disposed between the interface board and the push block and to which the insert member is mounted;
- a temperature adjustment unit disposed on the push block to heat or cool the semiconductor package to a test temperature through the push block;
- and
- a heat transfer member configured to directly connect the push block and the interface board to heat or cool the interface board, wherein
- the push block comprises a flange member, and a pressing member extending from the flange member toward the interface board to pressurize the semiconductor package,
- the heat transfer member comprises a first heat transfer member configured to pass through the insert member and be brought into contact with the interface board, and a second heat transfer member for connecting the flange member with the first heat transfer member,
- the temperature adjustment unit is disposed on the flange member, and
- the heat transfer member directly connects the flange member and the interface board in order to transfer heat between the temperature adjustment unit and the interface board through the flange member and the heat transfer member.
7 more elements
A semiconductor package test apparatus comprising:
- a push block configured to press a semiconductor package toward an interface board for electrically connecting the semiconductor package to a tester to bring external terminals of the semiconductor package into contact with connection terminals of the interface board;
- an insulating member to which the push block is mounted;
- a match plate to which the insulating member is mounted;
- a driving unit for pushing the match plate so that the semiconductor package is connected to the interface board by the push block;
- an insert member having a pocket receiving the semiconductor package so that external terminals of the semiconductor package are exposed toward the interface board;
- a test tray disposed adjacent to the interface board and to which the insert member is mounted;
- a temperature adjustment unit disposed on the push block to heat or cool the semiconductor package to a test temperature through the push block;
- and
- a heat transfer member configured to directly connect the push block and the interface board through the insert member to heat or cool the interface board, wherein
- the push block comprises a flange member disposed the insulating member, and a pressing member extending from the flange member toward the interface board through the insulating member to pressurize the semiconductor package,
- the temperature adjustment unit is disposed on the flange member, and
- the heat transfer member extends from the flange member toward the interface board passing through the insulating member and the insert member and is brought into contact with the interface board in order to transfer heat between the temperature adjustment unit and the interface board through the flange member and the heat transfer member.
9 more elements
Dependencies are inferred from the claim text.