US 11,448,611 B2Granted

Structurally reinforced sensor and method for manufacturing the same

AssigneeMedtronic MiniMed, Inc.

InventorsChristina Pai, Brian P. McGee, Mohsen Askarinya, Mary Ellen B. Coe, Cynthia J. Jones, Hsiu-Hsin Chung, Nathan Hobbs, Jorge L. Nieto, Anirban Chakraborty

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Abstract

Sensors and methods for manufacturing sensors are provided. An exemplary method for manufacturing a sensor includes forming an electrode lead pattern over an insulator base substrate. Further, the method includes forming a structural backing layer over the electrode lead pattern and insulator base substrate. Also, the method includes performing a cutting process to cut through the structural backing layer to form a structural backing over the electrode lead pattern.

Claims20

Dependent claims

A method for manufacturing a sensor having a distal end and an intermediate region adjacent to the distal end, the method comprising:

forming sensor electrodes over an insulator base substrate, wherein the sensor electrodes are confined to the distal end of the sensor;
forming an electrode lead pattern over the insulator base substrate, wherein the electrode lead pattern includes electrode leads configured for contact with the sensor electrodes, and wherein the electrode leads extend completely across the intermediate region in a longitudinal direction;
forming a structural backing layer over the electrode lead pattern and insulator base substrate, wherein the structural backing layer is confined to the intermediate region;
and
performing a cutting process to cut through the structural backing layer to form a side edge of a structural backing over the electrode lead pattern, wherein the side edge extends completely across the structural backing layer in the longitudinal direction;
and
wherein the structural backing lies over at least two adjacent electrode leads in the intermediate region of the sensor.

4 more elements

A method for manufacturing sensors, the method comprising:

forming an insulator base substrate over a wafer;
forming a plurality of electrode lead patterns over the insulator base substrate;
forming an underlying layer of titanium or chromium over the electrode lead patterns and insulator base substrate;
forming a structural backing layer over the underlying layer of titanium or chromium;
and
performing a cutting process to cut through both the structural backing layer and the underlying layer of titanium or chromium to form a plurality of structural backings therefrom, wherein a structural backing is formed over each respective electrode lead pattern;
and
forming an upper insulator over each respective structural backing and the insulator base substrate after performing the cutting process to cut through both the structural backing layer and the underlying layer of titanium or chromium to form the plurality of structural backings therefrom.

5 more elements

Dependencies are inferred from the claim text.