Back to results
US 11,447,677 B2Granted
Thermal interface material with mixed aspect ratio particle dispersions
AssigneeHenkel AG & Co. KGaA
InventorsJohn Timmerman, Sanjay Misra
Life of this patent
Estimating the term…
Abstract
An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
Claims18
A method for shielding electromagnetic interference in an electronic package, said method comprising:
- (a) providing:
- (i) a heat-generating electronic component;
- (ii) a heat dissipation member;
- and
- (iii) an interference member comprising a polymer matrix and a heterogeneous particulate filler effective to suppress electromagnetic interference, the heterogeneous particulate filler being dispersed in said polymer matrix at 40-50% by volume, said heterogeneous particulate filler including substantially spherical alumina particles having an aspect ratio of between 0.8-1.2 and a median spherical particle diameter, and boron nitride platelet particles having a length, a width, a thickness, and a median platelet particle diameter, wherein said platelet length and platelet width are each greater than said platelet thickness, said boron nitride platelet particles having an aspect ratio of at least 10, a volumetric loading ratio of said boron nitride platelet particles to said substantially spherical alumina particles being between 0.1:1 and 0.2:1, and a particle diameter ratio of said medium platelet particle diameter to said medium spherical diameter between 1:1 and 10:1;
- and
- (b) arranging said interface member between said heat-generating electronic component and said heat dissipation member along a thermal dissipation pathway from said heat-generating electronic component to said heat dissipation member, wherein said interface member exhibits a thermal conductivity of at least 0.5 W/m·K, a bulk hardness of between 10-70 Shore 00 at 20° C., and an electromagnetic interference suppression of at least 10% along said thermal dissipation pathway.
4 more elements
A method for shielding electromagnetic interference in an electronic package, said method comprising:
- (a) providing:
- (i) a heat-generating electronic component;
- (ii) a heat dissipation member;
- and
- (iii) an interference member comprising a polymer matrix and a heterogeneous particulate filler effective to suppress electromagnetic interference, the heterogeneous particulate filler being dispersed in said polymer matrix at 25-45% by volume, said heterogeneous particulate filler including substantially spherical alumina particles having an aspect ratio of between 0.8-1.2 and a median spherical particle diameter, and graphene platelet particles having a length, a width, a thickness, and a median platelet particle diameter, wherein said platelet length and platelet width are each greater than said platelet thickness, said graphene platelet particles having an aspect ratio of at least 10, a volumetric loading ratio of said graphene platelet particles to said substantially spherical alumina particles being between 0.1:1 and 0.2:1, and a particle diameter ratio of said medium platelet particle diameter to said medium spherical diameter between 1:1 and 10:1;
- and
- (b) arranging said interface member between said heat-generating electronic component and said heat dissipation member along a thermal dissipation pathway from said heat-generating electronic component to said heat dissipation member, wherein said interface member exhibits a thermal conductivity of at least 0.5 W/m·K, a bulk hardness of between 10-70 Shore 00 at 20° C., and an electromagnetic interference suppression of at least 10% along said thermal dissipation pathway.
4 more elements
Dependencies are inferred from the claim text.