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US 11,447,626 B2Granted
Resin composition for reinforcement and electronic component device
AssigneeKoki Company Limited
InventorsTakeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
Life of this patent
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Abstract
Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
Claims17
A reinforcing resin composition comprising:
- an epoxy compound, a curing agent, and a gelling agent;
- wherein the epoxy compound is a bisphenol E type epoxy resin alone or a mixture of a bisphenol E type epoxy resin with one or more additional epoxy resins, provided that the bisphenol E type epoxy resin is present in an amount of 25 mass % or more and 100 mass % or less relative to the total mass of the epoxy compound;
- and
- wherein the gelling agent has an action of gelling the epoxy compound and can prevent the resin composition from sagging when the resin composition is applied and heat cured.
1 more element
Dependencies are inferred from the claim text.