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US 11,447,388 B2Granted
MEMS package, MEMS microphone and method of manufacturing the MEMS package
AssigneeSAE Magnetics (H.K.) Ltd.
InventorsHiroshi Take, Makoto Yoshida, Anthony Reymund Melad Binarao, Cheng Bu Heng
Life of this patent
Estimating the term…
Abstract
A MEMS package includes a MEMS chip, a package substrate which the MEMS chip is adhered and a thin-film filter which is adhered to the package substrate or the MEMS chip. The thin-film filter includes a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface. The through holes are formed in an adhesive region of the thin-film part. The adhesive region is adhered to the package substrate or the MEMS chip.
Claims11
A MEMS package comprising:
- a MEMS chip;
- a package substrate which the MEMS chip is adhered;
- and
- a thin-film filter which is adhered to the package substrate or the MEMS chip,
- wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and
- a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface,
- wherein the through holes are formed in an adhesive region of the thin-film part,
- wherein the adhesive region is adhered to the package substrate or the MEMS chip,
- wherein the MEMS package further comprises:
- an adhesive-layer-entering structure which a filter-adhesive layer, being used for an adhesion of the thin-film filter, enters the through holes.
7 more elements
A MEMS package comprising:
- a MEMS chip;
- a package substrate which the MEMS chip is adhered;
- and
- a thin-film filter which is adhered to the package substrate or the MEMS chip,
- wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and
- a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface,
- wherein the through holes are formed in an adhesive region of the thin-film part,
- wherein the adhesive region is adhered to the package substrate or the MEMS chip,
- wherein the MEMS package further comprises:
- stripes-formed inner wall surfaces having stripe-like parts formed along with an intersecting direction intersecting the film surface, the stripes-formed inner wall surfaces are formed inside the respective through holes.
7 more elements
A MEMS package comprising:
- a MEMS chip;
- a package substrate which the MEMS chip is adhered;
- and
- a thin-film filter which is adhered to the package substrate or the MEMS chip,
- wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and
- a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface,
- wherein the through holes are formed in an adhesive region of the thin-film part,
- wherein the adhesive region is adhered to the package substrate or the MEMS chip,
- wherein the through holes are further formed in a filter region except for the adhesive region of the thin-film part,
- wherein the MEMS package further comprises stripes-formed inner wall surfaces having stripe-like parts formed along with an intersecting direction intersecting the film surface, the stripes-formed inner wall surfaces are formed respectively inside both the through holes formed in the adhesive region and the through holes formed in the filter region.
7 more elements
A MEMS microphone comprising:
- a MEMS package;
- and
- a cap which wraps the MEMS package,
- wherein the MEMS package comprises a MEMS chip, a package substrate which the MEMS chip is adhered, and a thin-film filter which is adhered to the package substrate or the MEMS chip,
- wherein the thin-film filter comprises a thin-film part having a film surface and a rear film surface arranged a rear side of the film surface, and
- a plurality of through holes being formed to penetrate the thin-film part from the film surface to the rear film surface,
- wherein the through holes are formed in an adhesive region of the thin-film part,
- wherein the adhesive region is adhered to the package substrate or the MEMS chip,
- the MEMS microphone further comprises:
- an adhesive-layer-entering structure which a filter-adhesive layer, being used for an adhesion of the thin-film filter, enters the through holes.
7 more elements
Dependencies are inferred from the claim text.