Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device

A manufacturing method of a molded semiconductor device, comprising:

• mounting a semiconductor device on a substrate;
• providing a lower mold for carrying the semiconductor device mounted on the substrate;
• providing an upper mold over the lower mold, wherein the upper mold comprises a mold part covering an upper surface of the semiconductor device and a dynamic part disposed around a device receiving region of the upper mold;
• moving a dynamic part relatively to the mold part along a first direction;
• injecting a molding material into the device receiving region for encapsulating the semiconductor device;
• and
• after the molding material fills a space between the semiconductor device and the substrate, moving the dynamic part relatively to the mold part along a second direction opposite to the first direction.