Soldering system including temperature distribution measurement control device, control method, and program
AssigneeMitsubishi Electric Corporation
InventorsTakashi Kobayashi, Masayoshi Tamura, Nobuyasu Kitagawa, Tsuyoshi Tanabe
Life of this patent
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Abstract
A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.
Claims13
A soldering system for jetting molten solder stored inside a solder bath to solder a solder workpiece, the soldering system comprising:
- a temperature measurer to measure a temperature distribution of a surface of the solder workpiece;
- a difference calculator to calculate the temperature distribution measured by the temperature measurer against a target temperature distribution and obtain a difference between the measured temperature distribution and the target temperature distribution;
- an identifier to identify whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within a set allowable range;
- a learning unit to obtain a control parameter when the identifier identifies the temperature distribution of the surface of the solder workpiece as being outside of the allowable range, the control parameter making the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range;
- and
- a driver to drive the soldering system based on the control parameter obtained by the learning unit,
- wherein the identifier identifies, through machine learning based on the difference, whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable range.
A control apparatus comprising:
- a difference calculator to
- calculate a temperature distribution of a surface of a solder workpiece against a target temperature distribution, the temperature distribution of the surface of the solder workpiece being acquired from a temperature measurer that measures the temperature distribution of the surface of the solder workpiece, and
- obtain a difference between the acquired temperature distribution and the target temperature distribution;
- an identifier to identify whether or not the acquired temperature distribution is a temperature distribution that is within a set allowable range;
- a learning unit to obtain a control parameter of a soldering system when the identifier identifies the temperature distribution of the surface of the solder workpiece as being outside of the allowable range, the control parameter making the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range;
- and
- a driver to drive the soldering system based on the control parameter of the soldering system obtained by the learning unit,
- wherein the identifier identifies, through machine learning based on the difference, whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable range.
A control method of a soldering system for jetting molten solder stored in a solder bath to solder a solder workpiece, the control method comprising:
- measuring a temperature distribution of a surface of the solder workpiece;
- calculating the measured temperature distribution of the surface of the solder workpiece against a target temperature distribution, and obtaining a difference between the measured temperature distribution and the target temperature distribution;
- identifying whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within a set allowable range;
- and
- obtaining a control parameter of the soldering system when the temperature distribution of the surface of the solder workpiece is identified as being outside of the allowable range, the control parameter making the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range,
- wherein the identifying includes identifying, through machine learning based on the difference, whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable range.
A non-transitory computer-readable recording medium storing a program, the program causing a computer to function as:
- a temperature measurer to measure a temperature distribution of a surface of a solder workpiece;
- a difference calculator to calculate the temperature distribution measured by the temperature measurer against a target temperature distribution, and obtain a difference between the measured temperature distribution and the target temperature distribution;
- an identifier to identify whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within a set allowable range;
- and
- a learning unit to obtain a control parameter of a soldering system when the identifier identifies the temperature distribution of the surface of the solder workpiece as being outside of the allowable range, the control parameter making the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range,
- wherein the identifier identifies, through machine learning based on the difference, whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable ran e.
A soldering system for jetting molten solder stored inside a solder bath to solder a solder workpiece, the soldering system comprising:
- a learning unit to obtain, based on a temperature distribution of a surface of the solder workpiece that is measured through reflection by an infrared reflective mirror of infrared rays emitted from the solder workpiece, a control parameter that makes the temperature distribution of the surface of the solder workpiece a temperature distribution that is within a set allowable range;
- and
- a driver to drive the soldering system based on the control parameter obtained by the learning unit.
Dependencies are inferred from the claim text.