System for cleaning wafer in CMP process of semiconductor manufacturing fabrication
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Ying Tien, Chia-Lin Hsueh
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Abstract
A system for performing a Chemical Mechanical Polishing (CMP) process is provided. The system includes a CMP module configured to polish a semiconductor wafer. The system further includes a cleaning brush assembly configured to clean the semiconductor wafer. The cleaning brush includes a rotation shaft and a brush member surrounding a segment of the rotation shaft. The system also includes an agitation transducer arranged to be distant from the brush member and configured to produce an agitated cleaning liquid to clean the cleaning brush assembly.
Claims20
A cleaning module for cleaning a semiconductor wafer after a Chemical Mechanical Polishing (CMP) process, the cleaning module comprising:
- a cleaning brush assembly configured to clean the semiconductor wafer and comprising a rotation shaft and a brush member surrounding the rotation shaft;
- a cleaning liquid source configured to supply a cleaning liquid;
- and
- an agitation transducer fluidly connected to the cleaning liquid source and configured to agitate the cleaning liquid from the cleaning liquid source to produce an agitated cleaning liquid to clean the cleaning brush assembly, wherein the agitation transducer is arranged to be distant from and outside the brush member, and an outlet of the agitation transducer faces the brush member so as to apply the agitated cleaning liquid to an outer surface of the brush member.
A cleaning module for cleaning a semiconductor wafer after a Chemical Mechanical Polishing (CMP) process, the cleaning module comprising:
- a cleaning brush assembly configured to clean the semiconductor wafer and comprising a rotation shaft and a brush member surrounding a segment of the rotation shaft;
- and
- an agitation transducer connected to the rotation shaft, circumferentially surrounding a segment of the rotation shaft which is not covered by the brush member, and configured to agitate a cleaning liquid in the rotation shaft.
A cleaning module for cleaning a semiconductor wafer after a Chemical Mechanical Polishing (CMP) process, the cleaning module comprising:
- a cleaning brush assembly configured to clean the semiconductor wafer and comprising a rotation shaft and a brush member surrounding the rotation shaft;
- and
- an agitation transducer configured to produce an agitated cleaning liquid to clean the cleaning brush assembly, wherein the agitation transducer is arranged outside the brush member, and an outlet of the agitation transducer faces the brush member so as to apply the agitated cleaning liquid to an outer surface of the brush member.
Dependencies are inferred from the claim text.