Vapor phase deposition of organic films
AssigneeASM IP Holding B.V.
InventorsViljami J. Pore, Marko Tuominen, Hannu Huotari
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Abstract
Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve.
Claims29
An apparatus for organic film deposition, comprising:
- a vessel configured for vaporizing an organic reactant to form a reactant vapor;
- a reaction space configured to accommodate a substrate and in selective fluid communication with the vessel;
- and
- a control system configured to:
- maintain the reactant in the vessel at or above a temperature A, wherein the reactant is vaporized at the temperature A;
- maintain the substrate at a temperature B, the temperature B being in a range from about 100° C. to about 180° C., and the temperature B being between about 5° C. and about 50° C. lower than the temperature A;
- transport the reactant vapor from the vessel to the substrate;
- and
- deposit an organic film on the substrate while maintaining the reactant in the vessel at or above the temperature A and maintaining the substrate at the temperature B.
A method for vapor depositing an organic film, comprising:
- vaporizing a first organic reactant in a vaporizer at a temperature A to form a first reactant vapor;
- exposing a substrate in a reaction space to the first reactant vapor at a temperature B, the temperature B being lower than the temperature A, the temperature B is selected from the range of about 100° C. to about 180° C., and the temperature B being between about 5° C. and about 50° C. lower than the temperature A;
- and
- depositing the organic film on the substrate while vaporizing the first organic reactant in the vaporizer at the temperature A and exposing the substrate to the first reactant vapor at the temperature B during the depositing.
A method for vapor depositing an organic film, comprising:
- vaporizing a first organic reactant in a vaporizer at a temperature A to form a first reactant vapor;
- exposing a substrate in a reaction space to the first reactant vapor at a temperature B, the temperature B being lower than the temperature A, and the temperature B is selected from the range of about 100° C. to about 250° C.;
- depositing the organic film on the substrate while vaporizing the first organic reactant in the vaporizer at the temperature A and exposing the substrate to the first reactant vapor at the temperature B during the depositing;
- and
- maintaining a pressure within the vaporizer at a pressure higher than a pressure in the reaction space while depositing.
Dependencies are inferred from the claim text.