Process for spray-applying a non-aqueous two-component filler coating composition onto a substrate

A process for applying a non-aqueous two-component filler coating composition comprising a binder component (A) and a curing component (B) onto a substrate, the process comprising:

• i) heating at least one of the binder component (A) and the curing component (B) to a temperature in the range of from 40 to 140° C.;
• ii) subsequently mixing the binder component (A) and the curing component (B) to obtain a hot filler coating composition;
• iii) spraying the hot filler coating composition obtained in step ii) onto the substrate to obtain a filler coating layer having a wet film thickness in the range of from 1 to 30 mm;
• iv) optionally spraying further hot filler coating composition obtained in step ii) to obtain one or more further filler coating layers having a wet film thickness in the range of from 1 to 30 mm;
• and
• v) allowing the filler coating layer(s) obtained in step iii) and, if present, in step iv) to cure to obtain a cured filler coating,
• wherein the binder component (A) comprises an epoxy resin and the curing component (B) comprises a curing agent for curing the epoxy resin and wherein the filler coating composition comprises:
• a) in the range of from 15 to 35 wt % hollow glass microspheres, wherein the hollow glass microspheres have an average density in the range of from 0.23 to 0.70 g/cm3 and a mean particle size of at most 52 μm;
• b) in the range of from 0 to 15 wt % inorganic solid material other than hollow glass microspheres;
• and
• c) in the range of from 0 to 20 wt % organic solvent.