Implant comprising embedded conductor track and production method
AssigneeBIOTRONIK SE & Co. KG
InventorsEckardt Bihler, Marc Hauer, Dirk Muessig
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Abstract
The disclosure related to an implant comprising a substrate, a housing, wherein the housing is disposed on the substrate, an electronic circuit disposed on the substrate inside the housing, an electronic component disposed on the substrate outside the housing, and a conductor track, wherein the conductor track connects the electronic circuit to the electronic component. The conductor track is embedded into the substrate at least in sections in such a way that at least one section of the conductor track is completely surrounded by the substrate. Furthermore, a method for creating an implant is disclosed.
Claims14
An implant comprising:
- a substrate having a heating element integrated therein;
- a housing, wherein the housing is disposed on the substrate so that edges of the housing are disposed on the heating element, wherein heating the heating element forms a hermetic seal between the housing and the substrate;
- an electronic circuit disposed on the substrate inside the housing;
- an electronic component disposed on the substrate outside the housing;
- a conductor track, wherein the conductor track connects the electronic circuit to the electronic component;
- wherein the conductor track is embedded into the substrate at least in sections so that at least one section of the conductor track is completely surrounded by the substrate.
A method for creating an implant, comprising the following steps:
- providing a substrate having a heating element integrated therein defining a housing boundary;
- disposing an electronic circuit on the substrate within the housing boundary;
- disposing a housing on the substrate so that edges of the housing are disposed on the heating element and the electronic circuit is disposed inside the housing;
- heating the heating element to hermetically seal the housing to the substrate;
- disposing an electronic component on the substrate outside the housing;
- and
- establishing a connection between the electronic circuit and the electronic component by way of a conductor track,
- wherein the conductor track is embedded into the substrate at least in sections so that at least one section of the conductor track is completely surrounded by the substrate.
Dependencies are inferred from the claim text.