Optical module for endoscope, endoscope, and manufacturing method for optical module for endoscope

An optical module for endoscope comprising:

• an optical element including a light emitting section configured to output an optical signal from an optical fiber or a light receiving section to which the optical signal is inputted and an external terminal connected to the light emitting section or the light receiving section;
• a first substrate including a first principal plane and a second principal plane opposed to the first principal plane, the optical element being mounted on the second principal plane;
• a second substrate including a third principal plane and a fourth principal plane opposed to the third principal plane, the optical element being housed in a recessed section of the third principal plane;
• and
• a solder ring configured to bond the first substrate and the second substrate, wherein
• an annular seal ring of the second principal plane of the first substrate and a guard ring of the third principal plane of the second substrate are bonded via the solder ring, and the recessed section is sealed up,
• the first substrate includes, on the second principal plane, a connection electrode disposed on an inner side of the seal ring, the connection electrode electrically connecting the external terminal of the optical element and the seal ring,
• the second substrate includes a lower electrode on the fourth principal plane and further includes a through-wire electrically connecting the guard ring of the third principal plane and the lower electrode, and
• the external terminal of the optical element is electrically connected to the lower electrode via the connection electrode, the seal ring, the solder ring, the guard ring, and the through-wire.

A manufacturing method for an optical module for endoscope comprising:

• manufacturing an optical element, a first wafer, and a second wafer, the optical element including a light emitting section configured to output an optical signal or a light receiving section to which the optical signal is inputted, the optical element further including an external terminal connected to the light emitting section or the light receiving section, the first wafer including a first substrate including a first principal plane and a second principal plane opposed to the first principal plane the first substrate including, on the second principal plane, an annular seal ring and a connection electrode disposed on an inner side of the seal ring and electrically connecting with the seal ring, and the second wafer including a second substrate including a third principal plane and a fourth principal plane opposed to the third principal plane, the second substrate including an annular guard ring on the third principal plane, a lower electrode on the fourth principal plane, a through-wire electrically connecting the guard ring and the lower electrode, and a recessed section surrounded by the guard ring;
• mounting the optical element on the second principal plane of the first substrate and bonding the external terminal of the optical element to the connection electrode of the first substrate;
• bonding the seal ring of the first substrate and the guard ring of the second substrate via an annular solder ring to house the optical element in the recessed section of the second substrate, electrically connecting the external terminal to the lower electrode via the connection electrode, the seal ring, the solder ring, the guard ring, and the through-wire, and manufacturing a laminated wafer in which the recessed section is sealed up;
• and
• cutting and singulating the laminated wafer.