# US 11,445,645 B2 · Hollow shielding structure for different types of circuit elements and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,445,645 B2 - Document ID: US11445645B2 - Status: Granted - Kind: B2 - Application number: 16/262,080 - Filed: 2019-01-30 - Published: 2019-05-30 - Granted: 2022-09-13 - Earliest claimed: 2016-05-04 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Keon Kuk; Il-ju Mun; Ji-woon Yeom; Yeon-kyoung Jung; Kyong-il Kim - Web page: https://patentgrep.com/patent/US11445645B2 ## CPC - H05K 9/0022: {of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20)} - H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors - H05K 9/0032: {having multiple parts, e.g. frames mating with lids} - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 1/0236: {Electromagnetic band-gap structures} - H05K 2201/10371: Shields or metal cases - H05K 2201/2018: Presence of a frame in a printed circuit or printed circuit assembly - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49126: Assembling bases - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover. ## Claims ### Claim 1 A hollow shielding structure for different types of circuit elements, the hollow shielding structure comprising: a printed circuit board (PCB) on which at least one element is mounted; a shield dam surrounding the at least one element; and a shield cover configured to: electrically couple to an upper portion of the shield dam, and cover the at least one element, wherein a gap is formed between the at least one element and the shield cover, wherein the shield dam and the shield cover are electrically coupled through a conductive adhesion part, and wherein the adhesion part is located between the upper portion of the shield dam and a seating portion of the shield cover. ### Claim 2 (depends on 1) The hollow shielding structure as claimed in claim 1, wherein a step is formed in a portion of the shield cover. ### Claim 3 (depends on 2) The hollow shielding structure as claimed in claim 2, wherein the step is formed in a portion of the shield cover close to the shield dam. ### Claim 4 (depends on 2) The hollow shielding structure as claimed in claim 2, wherein the step is formed along an edge portion of the shield cover. ### Claim 5 (depends on 2) The hollow shielding structure as claimed in claim 2, wherein a height of the shield cover is smaller than that of the at least one element. ### Claim 6 (depends on 1) The hollow shielding structure as claimed in claim 1, wherein the conductive adhesion part comprises a material having an electromagnetic wave shield characteristic which prevents electromagnetic interference (EMI). ### Claim 7 (depends on 6) The hollow shielding structure as claimed in claim 6, wherein a plurality of slots in which the adhesion part flows are formed in the shield cover. ### Claim 8 (depends on 7) The hollow shielding structure as claimed in claim 7, wherein a plurality of seating portions comprises: a first portion in contact with the upper portion of the shield dam, and a side of the shield dam and a second portion bent from an edge of the first portion are formed in the shield cover, and wherein the plurality of slots is formed in the plurality of seating portions. ### Claim 9 (depends on 8) The hollow shielding structure as claimed in claim 8, wherein the plurality of slots is configured to: penetrate the first portion, or simultaneously penetrate the first portion and the second portion. ### Claim 10 (depends on 1) The hollow shielding structure as claimed in claim 1, wherein the shield cover comprises a conductive metal material. ### Claim 11 (depends on 1) The hollow shielding structure as claimed in claim 1, wherein the shield cover comprises: a conductive tape attached to the shield dam; and a shape maintenance layer configured to maintain a shape of the conductive tape. ### Claim 12 (depends on 1) The hollow shielding structure as claimed in claim 1, wherein at least one air discharge hole is formed in the shield cover. ### Claim 13 (depends on 1) The hollow shielding structure as claimed in claim 1, wherein the shield dam comprises a conductive material, and wherein the shield dam is coupled to a ground pad formed in the PCB. ### Claim 14 (depends on 13) The hollow shielding structure as claimed in claim 13, wherein the shield dam is continuously or discontinuously coupled to the ground pad formed in the PCB. ### Claim 15 (depends on 1) The hollow shielding structure as claimed in claim 1, wherein the shield dam comprises a shield dam formed through three-dimensional (3D) printing, and wherein the shield dam has an aspect ratio such that a height of a cross section in the shield dam is larger than a width of the cross-section. ### Claim 16 A hollow shielding structure for different types of circuit elements, the hollow shielding structure comprising: a printed circuit board (PCB) on which at least one element is mounted; a shield dam surrounding the at least one element; a shield cover configured to be spaced from a top of the at least one element and covers the at least one element; and an adhesion part configured to electrically couple the shield dam and the shield cover, wherein a step is formed in the shield cover so that a portion of the shield cover which is in contact with the shield dam is located lower than a remaining portion thereof, and wherein the adhesion part is located between the upper portion of the shield dam and a seating portion of the shield cover.