# US 11,445,630 B2 · High power multilayer module having low inductance and fast switching for paralleling power devices

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- Number: US 11,445,630 B2
- Document ID: US11445630B2
- Status: Granted
- Kind: B2
- Application number: 17/149,815
- Filed: 2021-01-15
- Published: 2021-05-06
- Granted: 2022-09-13
- Earliest claimed: 2017-01-13
- Assignees: Wolfspeed, Inc.
- Applicants: Wolfspeed, Inc.
- Inventors: Matthew Feurtado; Brice McPherson; Daniel Martin; Alexander Lostetter
- Web page: https://patentgrep.com/patent/US11445630B2

## CPC

- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H02M 1/088: for the simultaneous control of series or parallel connected semiconductor devices
- H02M 7/537: using semiconductor devices only, e.g. single switched pulse inverters
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 1/181: associated with surface mounted components
- H05K 5/0069: {having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing}
- H05K 5/0247: {Electrical details of casings, e.g. terminals, passages for cables or wiring}
- H05K 7/14329: {specially adapted for the configuration of power bus bars}
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)}
- H05K 7/20909: {Forced ventilation, e.g. on heat dissipaters coupled to components}
- H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)}
- H10W 90/00: Package configurations
- H02M 1/0054: {Transistor switching losses (periodically suspending operation of switching converter in low power mode H02M1/0035)}
- H02M 1/327: {against abnormal temperatures}
- H02M 1/44: Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
- H05K 1/0262: {Arrangements for regulating voltages or for using plural voltages}
- H05K 2201/064: Fluid cooling, e.g. by integral pipes
- H05K 2201/10151: Sensor
- H05K 2201/10272: Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
- H10W 40/228: {the projecting parts being wire-shaped or pin-shaped}
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires}
- H10W 72/926: {Multiple bond pads having different sizes}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

## Claims

### Claim 1

A power module, comprising:
at least one power substrate;
a housing arranged on the at least one power substrate;
a first terminal electrically connected to the at least one power substrate;
a second terminal;
a third terminal electrically connected to the at least one power substrate; and
a plurality of power devices electrically connected to the at least one power substrate,
wherein the power module is structured, arranged, and configured to increase a power device utilization within the power module; and
wherein the power device utilization is defined as a percentage calculated by a ratio of a power device area to a total power module area and the power device utilization comprises a range of 5-10%.

### Claim 2 (depends on 1)

The power module of claim 1,
wherein the power module is structured, arranged, and configured to reduce switching losses of the power module; and
wherein the switching losses of the power module have a range of 0.5 (mJ/A) to 0.25 (mJ/A).

### Claim 3 (depends on 2)

The power module of claim 2, wherein a total stray inductance value of a critical power switching loop of the power module comprises a range of 12 (nH) to 2 (nH).

### Claim 4 (depends on 2)

The power module of claim 2,
wherein the switching losses of the power module have a range of 0.4 (mJ/A) to 0.25 (mJ/A).

### Claim 5 (depends on 1)

The power module of claim 1,
wherein the first terminal, the second terminal, and the third terminal each comprise power terminals;
wherein the first terminal comprises a contact surface at a first elevation; and
wherein the second terminal comprises a contact surface at a second elevation different from the first elevation.

### Claim 6 (depends on 1)

The power module of claim 1, wherein the power device utilization is defined as a percentage calculated by a ratio of a power device area to a total power module area that comprises a range of 6-8%.

### Claim 7 (depends on 1)

The power module of claim 1, wherein the power device utilization is defined as a percentage calculated by a ratio of a power device area to a total power module area that comprises a range of 7-10%.

### Claim 8 (depends on 1)

The power module of claim 1, wherein a total stray inductance value of a critical power switching loop of the power module comprises a range of 12 (nH) to 2 (nH).

### Claim 9 (depends on 1)

An inverter that comprises the power module of claim 1, the inverter comprising:
the power module; and
at least one component comprising at least one of the following: at least one buss bar, a driver, a controller, at least one capacitor, a cold plate, and at least one sensor.

### Claim 10 (depends on 1)

A power system that comprises the power module of claim 1, the power system comprising:
the power module; and
at least one component comprising at least one of the following: at least one buss bar, a driver, a controller, at least one capacitor, a cold plate, and at least one sensor,
wherein the power system comprises at least one of the following: an inverter, a motor system, and a charging system.

### Claim 11

A power module, comprising:
at least one power substrate;
a housing arranged on the at least one power substrate;
a first terminal electrically connected to the at least one power substrate;
a second terminal;
a third terminal electrically connected to the at least one power substrate; and
a plurality of power devices electrically connected to the at least one power substrate,
wherein the power module is structured, arranged, and configured to increase a power device utilization of the power module; and
wherein the power device utilization is defined as a percentage calculated by a ratio of a power device area to a total power module area that comprises a range of 5-10%.

### Claim 12 (depends on 11)

The power module of claim 11,
wherein the power module is structured, arranged, and configured to reduce switching losses of the power module; and
wherein the switching losses of the power module have a range of 0.5 (mJ/A) to 0.25 (mJ/A).

### Claim 13 (depends on 12)

The power module of claim 12, wherein the switching losses of the power module have a range of 0.4 (mJ/A) to 0.25 (mJ/A).

### Claim 14 (depends on 13)

The power module of claim 13, wherein a total stray inductance value of a critical power switching loop of the power module comprises a range of 12 (nH) to 2 (nH).

### Claim 15 (depends on 11)

The power module of claim 11,
wherein the first terminal, the second terminal, and the third terminal each comprise power terminals;
wherein current flows in a first direction from the first terminal across the at least one power substrate; and
wherein the current flows in a second direction, opposite to the first direction, from the at least one power substrate to the second terminal to reduce impedance.

### Claim 16 (depends on 11)

The power module of claim 11, wherein the power device utilization is defined as a percentage calculated by a ratio of a power device area to a total power module area that comprises a range of 6-8%.

### Claim 17 (depends on 11)

The power module of claim 11, wherein the power device utilization is defined as a percentage calculated by a ratio of a power device area to a total power module area that comprises a range of 7-10%.

### Claim 18 (depends on 11)

The power module of claim 11, wherein a total stray inductance value of a critical power switching loop of the power module comprises a range of 12 (nH) to 2 (nH).

### Claim 19 (depends on 11)

A power system that comprises the power module of claim 11, the power system comprising:
the power module; and
at least one component comprising at least one of the following: at least one buss bar, a driver, a controller, at least one capacitor, a cold plate, and at least one sensor,
wherein the power system comprises at least one of the following: an inverter, a motor system, and a charging system.

### Claim 20

An inverter, the inverter comprising:
a power module;
at least one of the following: at least one buss bar, a driver, a controller, at least one capacitor, a cold plate, and at least one sensor; and
the power module comprises at least one of the following:
at least one power substrate;
a housing arranged on the at least one power substrate;
a first terminal electrically connected to the at least one power substrate;
a second terminal; and
a plurality of power devices electrically connected to the at least one power substrate,
wherein the power module is structured, arranged, and configured to increase a power device utilization of the power module; and
wherein the power device utilization is defined as a percentage calculated by a ratio of a power device area to a total power module area that comprises a range of 5-10%.