# US 11,445,627 B2 · Resin card medium and manufacturing method therefor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,445,627 B2 - Document ID: US11445627B2 - Status: Granted - Kind: B2 - Application number: 16/649,303 - Filed: 2018-09-20 - Published: 2020-08-20 - Granted: 2022-09-13 - Earliest claimed: 2017-09-22 - Assignees: Shoei Printing Co., Ltd.; Tomoegawa Co., Ltd. - Applicants: Shoei Printing Co., Ltd.; Tomoegawa Co., Ltd. - Inventors: Tomohiro Nakata; Hideki Moriuchi - Web page: https://patentgrep.com/patent/US11445627B2 ## CPC - B42D 25/36: comprising special materials - B32B 3/085: {spaced apart pieces on the surface of a layer} - B32B 5/02: characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)} - B32B 27/08: of synthetic resin - B32B 27/10: of paper or cardboard - B32B 27/12: next to a fibrous or filamentary layer - B32B 27/20: using fillers, pigments, thixotroping agents - B32B 27/281: {comprising polyimides} - B32B 27/36: comprising polyesters - B32B 29/005: {next to another layer of paper or cardboard layer} - B32B 37/10: characterised by the pressing technique, e.g. using action of vacuum or fluid pressure - B42D 25/23: Identity cards - B42D 25/305: Associated digital information (record carriers for use with machines and with at least a part designed to carry digital markings G06K19/00) - B42D 25/455: using heat - B42D 25/46: using pressure - G06K 19/07722: {the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00)} - H05K 5/065: {sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding} - B32B 37/0015: {to avoid warp or curl} - B32B 2262/02: Synthetic macromolecular fibres - B32B 2262/0284: Polyethylene terephthalate [PET] or polybutylene terephthalate [PBT] - B32B 2262/06: Vegetal fibres - B32B 2262/14: Mixture of at least two fibres made of different materials - B32B 2307/732: Dimensional properties - B32B 2307/734: Dimensional stability - B32B 2457/00: Electrical equipment - B42D: BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A resin card medium which has a substrate having electronic components mounted thereon and has sophisticated flatness and smoothness realized without providing any layer having holes for absorbing thicknesses of the electronic components; and a method for manufacturing a resin card medium. A resin card medium laminated body before pressing is prepared by laminating, on a first plastic finishing sheet, a substrate having one electronic component or two or more electronic components installed on one side of the substrate, with the one side, on which the electronic component or electronic components are installed, facing upward, and laminating, on the substrate, mixed paper constituted of plastic fibers and plant fibers, and by subjecting the resin card medium laminated body to hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers. ## Claims ### Claim 1 A resin card medium comprising: a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate; a plant fiber-containing resin layer being laminated on a surface of the substrate on a side on which the electronic component or electronic components are installed and containing plant fibers, and said plant fiber-containing resin layer only partially covers at least one of the electronic component(s); a first finishing layer being laminated on a surface of the substrate on a side opposite to the side on which the electronic component or electronic components are installed, and a second finishing layer is further laminated on the plant fiber-containing resin layer such that the plant fiber-containing resin layer is between the substrate and the second finishing layer, wherein a percentage of a total of a thickness of the substrate and a thickness or thicknesses of the electronic component or electronic components to a thickness of the card medium is 80% or less. ### Claim 2 (depends on 1) The resin card medium according to claim 1, wherein the percentage of the total of the thickness of the substrate and the thickness or thicknesses of the electronic component or electronic components to the thickness of the card medium is 70% or less. ### Claim 3 (depends on 1) The resin card medium according to claim 1, wherein the substrate is disposed in such a way as to be displaced to a front side or a rear side from a middle position in a thickness direction of the resin card medium in a longitudinal cross sectional view. ### Claim 4 (depends on 1) The resin card medium according to claim 1, further comprising a display part and/or a fingerprint detection part being installed on the substrate and being exposed outside by providing an opening part for one part of the plant fiber-containing resin layer. ### Claim 5 (depends on 1) The resin card medium according to claim 1, wherein the first finishing layer and/or the second finishing layer are/is plant fiber-non-containing resin layers or a plant fiber-non-containing resin layer which contain/contains no plant fibers. ### Claim 6 (depends on 5) The resin card medium according to claim 5, wherein a resin material of the plant fiber-containing resin layer and/or the plant fiber-non-containing resin layer is copolymerized polyester resin. ### Claim 7 (depends on 5) The resin card medium according to claim 5, wherein a resin material of the plant fiber-containing resin layer and/or the plant fiber-non-containing resin layer is polyethylene terephthalate. ### Claim 8 (depends on 1) The resin card medium according to claim 1, wherein a shape and dimensions of the resin card medium are in conformity with an ISO/IEC 7810:2003 standard. ### Claim 9 (depends on 8) The resin card medium according to claim 8, wherein a warpage amount of the resin card medium in conformity with the ISO/IEC 7810:2003 standard is 1.5 mm or less and besides the ISO standard, a depth of a local depressed part of the resin card medium is less than 0.2 mm. ### Claim 10 (depends on 1) A method for manufacturing the resin card medium according to claim 1, which is flat and smooth, comprising the steps of: preparing a first plastic finishing sheet; laminating, on the first finishing sheet, a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate, with the one side of the substrate, on which the electronic component or electronic components are installed, facing upward; laminating, on the substrate, mixed paper being constituted of plastic fibers and plant fibers, laminating a second plastic finishing sheet on the mixed paper, and hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers. ### Claim 11 (depends on 10) The method for manufacturing a resin card medium according to claim 10, wherein the resin card medium further comprises a display part and/or a fingerprint detection part being installed on the substrate and being exposed outside the resin card medium after hot pressing molding by providing an opening part for one part of the mixed paper. ### Claim 12 (depends on 10) The method for manufacturing a resin card medium according to claim 10, wherein the plastic fibers are copolymerized polyester resin (PET resin). ### Claim 13 (depends on 10) The method for manufacturing a resin card medium according to claim 10, wherein a thickness of the mixed paper, before pressing, being laminated on a surface of the substrate on a side on which the electronic component or electronic components are installed is thicker than a thickness of the first finishing sheet, before pressing, being laminated beneath a surface of the substrate on a side opposite to the side on which the electronic component or electronic components are installed. ### Claim 14 (depends on 10) The method for manufacturing a resin card medium according to claim 10, wherein a shape and dimensions of the obtained resin card medium are in conformity with an ISO/IEC 7810:2003 standard. ### Claim 15 (depends on 10) The method for manufacturing a resin card medium according to claim 10, wherein a warpage amount, of the obtained resin card medium, in conformity with the ISO/IEC 7810:2003 standard is 1.5 mm or less, and besides the ISO standard, a depth of a local depressed part of the resin card medium is less than 0.2 mm. ### Claim 16 (depends on 10) The method for manufacturing a resin card medium according to claim 10, wherein a percentage of a total of a thickness of the substrate and a thickness or thicknesses of the electronic component or electronic components to a thickness of the resin card medium after the hot pressing molding is adjusted to be 80% or less. ### Claim 17 (depends on 16) The method for manufacturing a resin card medium according to claim 16, wherein the percentage of the total of the thickness of the substrate and the thickness or the thicknesses of the electronic component or electronic components to the thickness of the resin card medium after the hot pressing molding is adjusted to be 70% or less. ### Claim 18 (depends on 1) A method for manufacturing manufacturing the resin card medium according to claim 1, which is flat and smooth, comprising the steps of: laminating mixed paper being constituted of plastic fibers and plant fibers; laminating, on the mixed paper, a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate, with the one side of the substrate, on which the electronic component or electronic components are installed, facing downward; laminating a first plastic finishing sheet on the substrate, preparing a second plastic finishing sheet beneath the mixed paper; and hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers. ### Claim 19 (depends on 18) The method for manufacturing a resin card medium according to claim 18, wherein the resin card medium further comprises a display part and/or a fingerprint detection part being installed on the substrate and being exposed outside the resin card medium after hot pressing molding by providing an opening part for one part of the mixed paper. ### Claim 20 (depends on 1) A resin card medium according to claim 1, which has been prepared by laminating, on a first plastic finishing sheet, a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate, with the one side, on which the electronic component or electronic components are installed, facing upward, and laminating, on the substrate, mixed paper being constituted of plastic fibers and plant fibers, laminating a second plastic finishing sheet on the mixed paper, wherein by subjecting the resin card medium laminated body to hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers, formed is the resin card medium whose card warpage amount in conformity with an ISO/IEC 7810:2003 standard is 1.5 mm or less and besides the ISO standard, whose depth of a local depressed part of the resin card medium is less than 0.2 mm. ### Claim 21 (depends on 20) The resin card medium according to claim 20, further comprising a display part and/or a fingerprint detection part being installed on the substrate and being exposed outside the resin card medium after hot pressing molding by providing an opening part for one part of the mixed paper. ### Claim 22 (depends on 20) The resin card medium according to claim 20, wherein a percentage of a total of a thickness of the substrate and a thickness or thicknesses of the electronic component or electronic components to a thickness of the resin card medium after the hot pressing molding is 80% or less. ### Claim 23 (depends on 22) The resin card medium according to claim 22, wherein the percentage of the total of the thickness of the substrate and the thickness or thicknesses of the electronic component or electronic components to the thickness of the resin card medium after the hot pressing molding is 70% or less.