# US 11,445,619 B2 · System and method for high-temperature lamination of printed circuit boards

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- Number: US 11,445,619 B2
- Document ID: US11445619B2
- Status: Granted
- Kind: B2
- Application number: 17/177,733
- Filed: 2021-02-17
- Published: 2022-04-28
- Granted: 2022-09-13
- Earliest claimed: 2020-10-28
- Assignees: Matrix Electronics Limited
- Applicants: Matrix Electronics Limited
- Inventors: Kieran Healy
- Web page: https://patentgrep.com/patent/US11445619B2

## CPC

- H05K 3/4635: {laminating flexible circuit boards using additional insulating adhesive materials between the boards}
- B32B 37/12: characterised by using adhesives
- B32B 37/26: with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B30B 15/061: {Cushion plates}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 27/10: of paper or cardboard
- B32B 27/12: next to a fibrous or filamentary layer
- B32B 27/281: {comprising polyimides}
- B32B 37/003: {to avoid air inclusion}
- B32B 37/226: {Laminating sheets, panels or inserts between two continuous plastic layers}
- B32B 38/162: {Cleaning}
- B32B 2037/268: {Release layers}
- H05K 2201/0154: Polyimide
- H05K 2203/068: Features of the lamination press or of the lamination process, e.g. using special separator sheets
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B30B: PRESSES IN GENERAL (producing ultra-high pressure or ultra-high pressure and high temperature to effect modifications of a substance, e.g. for making artificial diamonds B01J3/00 ){(compressing means for refuse receptacles B65F1/1405)}

## Abstract

A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film; cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and attaching a release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.

## Claims

### Claim 1

A method of manufacturing a press pad, the method comprising:
providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film;
cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and
attaching the release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.

### Claim 2 (depends on 1)

The method of claim 1, wherein the cleaning includes applying a stream of neutrally charged air over portions of surfaces of the planar pad.

### Claim 3 (depends on 1)

The method of claim 1, further comprising cleaning the release film sheet.

### Claim 4 (depends on 3)

The method of claim 3, wherein cleaning the release film sheet includes passing the release film sheet over at least one adhesive take-up roller, the at least one adhesive take-up roller having a tack for removing debris.

### Claim 5 (depends on 4)

The method of claim 4, wherein the at least one adhesive take-up roller is a silicon roller.

### Claim 6 (depends on 1)

The method of claim 1, further comprising thermally treating the release film sheet along its length.

### Claim 7 (depends on 1)

The method of claim 1, further comprising driving the press pad between a pair of curl elimination guides.