# US 11,445,616 B2 · Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures

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- Number: US 11,445,616 B2
- Document ID: US11445616B2
- Status: Granted
- Kind: B2
- Application number: 15/954,040
- Filed: 2018-04-16
- Published: 2019-10-17
- Granted: 2022-09-13
- Earliest claimed: 2018-04-16
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Suddhasattwa Nad; Rahul Manepalli; Marcel Wall
- Web page: https://patentgrep.com/patent/US11445616B2

## CPC

- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- G03F 7/091: {characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement}
- G03F 7/165: {Monolayers, e.g. Langmuir-Blodgett}
- H05K 1/0353: {consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement}
- H10P 76/204: {of organic photoresist masks}
- H10P 76/2043: {using an anti-reflective coating}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/69: Insulating materials thereof
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 44/223: {Differential pair signal lines}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments described herein are directed to interfacial layers and techniques of forming such interfacial layers. An interfacial layer having one or more light absorbing molecules is on a metal layer. The light absorbing molecule(s) may comprise a moiety exhibiting light absorbing properties. The interfacial layer can assist with improving adhesion of a resist layer to the metal layer and with improving use of one or more lithography techniques to fabricate interconnects and/or features using the resist and metal layers for a package substrate, a semiconductor package, or a PCB. For one embodiment, the interfacial layer includes, but is not limited to, an organic interfacial layer. Examples of organic interfacial layers include, but are not limited to, self-assembled monolayers (SAMs), constructs and/or variations of SAMs, organic adhesion promotor moieties, and non-adhesion promoter moieties.

## Claims

### Claim 1

A package substrate comprising:
a metal layer; and
an interfacial layer having one or more light absorbing molecules on the metal layer, wherein the one or more light absorbing molecules comprise a moiety comprising an aurone, wherein the interfacial layer comprises an organic interfacial layer, and wherein the organic interfacial layer comprises a self-assembled monolayer (SAM).

### Claim 2 (depends on 1)

The package substrate of claim 1, wherein the interfacial layer on the metal layer, comprises:
first molecules chemisorbed or physisorbed to a surface of the metal layer; and
second molecules reacted with the first molecules, wherein a product of the reaction is the interfacial layer and wherein one or more of the first molecules and the second molecules comprises the moiety.

### Claim 3 (depends on 2)

The package substrate of claim 2, wherein the first molecules comprise a head group (R1) and a tail group (R2 or R3) and wherein the second molecules comprise a head group (R5) and a tail group (R4).

### Claim 4 (depends on 3)

The package substrate of claim 3, wherein a reaction comprising a first tail group (R2) of the first molecules as a reagent produces a second tail group (R3) of the first molecules.

### Claim 5 (depends on 2)

The package substrate of claim 2, wherein the moiety is attached, using one or more carbon atoms, to one or more of a backbone of the first molecules and a backbone of the second molecules.

### Claim 6

A semiconductor package comprising:
a dielectric layer;
a metal layer on the dielectric layer; and
an interfacial layer having one or more light absorbing molecules on the metal layer, wherein the one or more light absorbing molecules comprise a moiety comprising an aurone, wherein the interfacial layer comprises an organic interfacial layer, and wherein the organic interfacial layer comprises a self-assembled monolayer (SAM).

### Claim 7 (depends on 6)

The semiconductor package of claim 6, wherein the interfacial layer on the metal layer, comprises:
first molecules chemisorbed or physisorbed to a surface of the metal layer; and
second molecules reacted with the first molecules, wherein a product of the reaction is the interfacial layer and wherein one or more of the first molecules and the second molecules comprises the moiety.

### Claim 8 (depends on 7)

The semiconductor package of claim 7, wherein the first molecules comprise a head group (R1) and a tail group (R2 or R3) and wherein the second molecules comprise a head group (R5) and a tail group (R4).

### Claim 9 (depends on 8)

The semiconductor package of claim 8, wherein a reaction comprising a first tail group (R2) of the first molecules as a reagent produces a second tail group (R3) of the first molecules.

### Claim 10 (depends on 7)

The semiconductor package of claim 7, wherein the moiety is attached, using one or more carbon atoms, to one or more of a backbone of the first molecules and a backbone of the second molecules.

### Claim 11

A printed circuit board (PCB) comprising:
a metal layer; and
an interfacial layer having one or more light absorbing molecules on the metal layer, wherein the one or more light absorbing molecules comprise a moiety comprising an aurone.

### Claim 12 (depends on 11)

The PCB of claim 11, wherein the interfacial layer comprises an organic interfacial layer.