# US 11,445,615 B2 · Touch sensor module and image display device comprising same

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- Number: US 11,445,615 B2
- Document ID: US11445615B2
- Status: Granted
- Kind: B2
- Application number: 17/184,572
- Filed: 2021-02-24
- Published: 2021-09-16
- Granted: 2022-09-13
- Earliest claimed: 2020-03-11
- Assignees: Dongwoo Fine-Chem Co., Ltd.
- Applicants: Dongwoo Fine-Chem Co., Ltd.
- Inventors: Jun-Ha Kim; Dong-Jin Son
- Web page: https://patentgrep.com/patent/US11445615B2

## CPC

- G06F 3/04164: {Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads}
- H05K 3/3405: {Edge mounted components, e.g. terminals}
- G06F 3/044: by capacitive means
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- G06F 2203/04102: Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
- H05K 3/346: Solder materials or compositions specially adapted therefor
- H05K 2201/10128: Display
- H05K 2201/10151: Sensor
- H05K 2203/041: Solder preforms in the shape of solder balls
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The present invention relates to a touch sensor module and an image display device including the same. The touch sensor module includes a touch sensor including pad portions, a flexible printed circuit board (FPCB) including terminal portions, and a solder joint interposed between the touch sensor and the flexible printed circuit board, in which the solder joint includes a solder paste including solder balls and a flux, the pad portions and the terminal portions are electrically connected through the solder balls compressed by heating and pressing, the flux is used in an amount of 5 to 40 wt % based on the total weight of the solder paste, and the ratio of the diameter of the solder balls included in the solder paste to the gap between the pad portions of the touch sensor and the terminal portions of the flexible printed circuit board is 1:0.2-0.6.

## Claims

### Claim 1

A touch sensor module, comprising:
a touch sensor comprising pad portions;
a flexible printed circuit board comprising terminal portions; and
a solder joint interposed between the touch sensor and the flexible printed circuit board,
wherein the solder joint comprises a solder paste comprising solder balls and a flux,
the pad portions and the terminal portions are electrically connected through the solder balls compressed by heating and pressing,
wherein a contact resistance between the pad portions and the terminal portions, which are electrically connected, is 1Ω to 5Ω,
the flux is used in an amount of 5 to 40 wt % based on a total weight of the solder paste, and
a ratio of a diameter of the solder balls to a gap between the pad portions of the touch sensor and the terminal portions of the flexible printed circuit, which is a ratio of the diameter of the solder balls in the solder paste to the gap between the pad portions of the touch sensor and the terminal portions of the flexible printed circuit, is 1:0.2-0.6.

### Claim 2 (depends on 1)

The touch sensor module of claim 1, wherein a width of each of the pad portions provided to the touch sensor and a space between the pad portions are 100 to 200 μm.

### Claim 3 (depends on 2)

The touch sensor module of claim 2, wherein the solder balls have a size of 1 to 50 μm.

### Claim 4 (depends on 1)

An image display device comprising the touch sensor module of claim 1.