Printed circuit board

A printed circuit board, comprising:

• a first insulating substrate having a mounting hole therein, the mounting hole penetrating through the first insulating substrate from a first surface to a second surface;
• a second insulating substrate including a connection portion, the connection portion penetrating through the mounting hole from the first surface side and protrudes from the second surface;
• a first electrode provided on the second surface and disposed at an edge of the mounting hole;
• and
• a second electrode provided on the connection portion,
• the first electrode and the second electrode being joined by solder, and
• the printed circuit board further including a coating film that is disposed at least on a front end side of the connection portion than a portion where the second electrode is joined to the first electrode by the solder, wherein
• a plurality of the second electrodes are provided, and
• the coating film is provided for each of the second electrodes.

A printed circuit board, comprising:

• a first insulating substrate having a mounting hole therein, the mounting hole penetrating through the first insulating substrate from a first surface to a second surface;
• a second insulating substrate including a connection portion, the connection portion penetrating through the mounting hole from the first surface side and protrudes from the second surface;
• a first electrode provided on the second surface and disposed at an edge of the mounting hole;
• and
• a second electrode provided on the connection portion,
• the first electrode and the second electrode being joined by solder, and
• the printed circuit board further including a coating film that is disposed at least on a front end side of the connection portion than a portion where the second electrode is joined to the first electrode by the solder, wherein
• a plurality of the second electrodes are provided, and
• the coating film is linearly provided along a direction in which the second electrodes are arranged.