# US 11,445,606 B2 · Laminated body and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,445,606 B2 - Document ID: US11445606B2 - Status: Granted - Kind: B2 - Application number: 17/206,303 - Filed: 2021-03-19 - Published: 2021-07-08 - Granted: 2022-09-13 - Earliest claimed: 2018-10-04 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yusuke Kamitsubo; Tsuyoshi Katsube; Ryosuke Takada - Web page: https://patentgrep.com/patent/US11445606B2 ## CPC - H05K 1/036: {Multilayers with layers of different types} - B32B 3/02: characterised by features of form at particular places, e.g. in edge regions {(non-uniform thickness B32B3/263)} - B32B 3/04: characterised by {at least one} layer folded at the edge, e.g. over another layer {; characterised by at least one layer enveloping or enclosing a material} - B32B 3/08: characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)} - B32B 7/022: Mechanical properties - B32B 7/025: Electric or magnetic properties - B32B 27/08: of synthetic resin - B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF} - B32B 27/322: {comprising halogenated polyolefins, e.g. PTFE} - B32B 27/36: comprising polyesters - B32B 27/38: comprising epoxy resins - H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)} - H05K 3/0064: {onto a polymeric substrate} - H05K 3/4611: {by laminating two or more circuit boards (H05K3/4652 takes precedence)} - H05K 3/4632: {laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets} - B32B 2307/204: Di-electric - B32B 2307/51: Elastic - B32B 2307/536: Hardness - B32B 2307/538: Roughness - B32B 2307/732: Dimensional properties - B32B 2457/08: PCBs, i.e. printed circuit boards - H05K 1/0219: {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors} - H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line} - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/0141: Liquid crystal polymer [LCP] - H05K 2201/015: Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/09236: Parallel layout - H05K 2203/0278: Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ## Abstract A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer. ## Claims ### Claim 1 A stacked body comprising: a first resin layer including thermoplastic; a conductor pattern provided on one principal surface of the first resin layer; and a second resin layer including thermoplastic; wherein the first resin layer is softer than the second resin layer; the first resin layer has a lower dielectric constant than the second resin layer; the conductor pattern includes a portion in contact with the first resin layer along a layer direction of the first resin layer and a portion in contact with the first resin layer along a stacking direction of the first resin layer, the second resin layer, and the conductor pattern; the conductor pattern is in contact with the second resin layer; and in a cross section in the stacking direction of the stacked body, in a peripheral length of the conductor pattern, a length of a portion where the conductor pattern is in contact with the first resin layer is larger than a length of a portion in contact with the second resin layer. ### Claim 2 (depends on 1) The stacked body according to claim 1, wherein a thickness of the second resin layer is larger than a thickness of the first resin layer. ### Claim 3 (depends on 1) The stacked body according to claim 1, wherein a main material of the first resin layer is fluororesin; and a main material of the second resin layer is a liquid crystal polymer. ### Claim 4 (depends on 1) The stacked body according to claim 1, wherein a surface roughness of one principal surface in contact with the first resin layer of the conductor pattern is larger than a surface roughness of the other principal surface. ### Claim 5 (depends on 1) The stacked body according to claim 1, wherein the second resin layer sandwiches the first resin layer from both sides in the stacking direction. ### Claim 6 (depends on 1) The stacked body according to claim 1, further comprising: a plurality of stacked sheets including a single first resin layer, a single second resin layer, and a single layer of the conductor pattern; wherein the conductor pattern of one stacked sheet of plurality of stacked sheets adjacent in the stacking direction and the second resin layer of another stacked sheet of the plurality of stacked sheet are in contact with each other. ### Claim 7 (depends on 6) The stacked body according to claim 6, wherein the plurality of stacked sheets include a first stacked sheet, a second stacked sheet, and a third stacked sheet sequentially arranged in the stacking direction; the conductor pattern provided on the second stacked sheet is a signal conductor pattern; the conductor pattern provided on the first stacked sheet is a first ground conductor pattern; the conductor pattern provided on the third stacked sheet is a second ground conductor pattern; and the signal conductor pattern, the first ground conductor pattern, and the second ground conductor pattern define a main portion of a transmission line. ### Claim 8 (depends on 7) The stacked body according to claim 7, wherein the signal conductor pattern is sandwiched between a second protruding portions of the single second resin layer of the first stacked sheet in a plane direction perpendicular or substantially perpendicular to the stacking direction. ### Claim 9 (depends on 8) The stacked body according to claim 8, wherein a surface roughness on the single first resin layer side of the signal conductor pattern is smaller than a surface roughness on the single first resin layer side of the first ground conductor pattern. ### Claim 10 (depends on 7) The stacked body according to claim 7, wherein the first stacked sheet includes a first interlayer connecting conductor conducting to the first ground conductor pattern; the second stacked sheet includes a second interlayer connecting conductor conducting to the second ground conductor patter; and the first interlayer connecting conductor and the second interlayer connecting conductor overlap each other in the stacking direction. ### Claim 11 (depends on 1) The stacked body according to claim 1, further comprising: a plurality of stacked sheets including a single first resin layer, a single second resin layer, and a single layer of the conductor pattern; wherein each of two stacked sheets of the plurality of stacked sheets adjacent to each other in the stacking direction includes an interlayer connecting conductor that penetrates the first resin layer and the second resin layer and includes an opposite surface wider than a surface in contact with the conductor pattern; and the opposite surfaces of the interlayer connecting conductors face each other and the interlayer connecting conductors are directly joined. ### Claim 12 A stacked body comprising: a first resin layer including thermoplastic; a conductor pattern provided on one principal surface of the first resin layer; and two second resin layers including thermoplastic; wherein the first resin layer is softer than the second resin layer; the conductor pattern includes a portion in contact with the first resin layer along a layer direction of the first resin layer and a portion in contact with the first resin layer along a stacking direction of the first resin layer, the second resin layer, and the conductor pattern; the conductor pattern is in contact with one of the second resin layers; another one of the second resin layers is in contact with a surface opposite to that of the conductor pattern in the first resin layer; and the another one of the second resin layers includes a second protruding portion along a corner portion of the conductor pattern embedded in the first resin layer. ### Claim 13 (depends on 12) The stacked body according to claim 12, wherein the first resin layer has a lower dielectric constant than the second resin layer. ### Claim 14 (depends on 12) The stacked body according to claim 12, wherein a cross-sectional shape of the conductor pattern in the stacking direction of the stacked body includes a corner portion embedded in the first resin layer. ### Claim 15 (depends on 14) The stacked body according to claim 14, wherein the first resin layer includes a first protruding portion along the corner portion of the conductor pattern embedded in the first resin layer on a surface opposite to a surface on which the conductor pattern is provided. ### Claim 16 (depends on 14) The stacked body according to claim 14, further comprising: an inclined portion at an edge of the conductor pattern in the cross-sectional shape; wherein the corner portion embedded in the first resin layer has an acute angle. ### Claim 17 (depends on 12) The stacked body according to claim 12, wherein the first resin layer sandwiches the conductor pattern from both sides in the stacking direction. ### Claim 18 (depends on 12) The stacked body according to claim 12, wherein the conductor pattern is sandwiched in the layer direction by a plurality of the second protruding portions. ### Claim 19 A method for manufacturing a stacked body, the method comprising: providing a conductor foil on a first resin layer including a first resin as a main material; stacking a second resin layer including a second resin as a main material on the first resin layer to form a stacked sheet including the first resin layer, the second resin layer, and the conductor foil; patterning the conductor foil; and stacking and heat-pressing a plurality of the stacked sheets to cause at least a portion of the conductor foil to be embedded in the first resin layer; wherein the conductor foil is in contact with the second resin layer; and in a cross section in a stacking direction of a stacked body, in a peripheral length of the conductor foil, a length of a portion at which the conductor foil is in contact with the first resin layer is larger than a length of a portion in contact with the second resin layer. ### Claim 20 A method for manufacturing a stacked body, the method comprising: providing a conductor foil on a first resin layer including a first resin as a main material; stacking two second resin layers including a second resin as a main material on the first resin layer to form a stacked sheet including the first resin layer, the second resin layer, and the conductor foil; patterning the conductor foil; and stacking and heat-pressing a plurality of the stacked sheets to cause at least a portion of the conductor foil to be embedded in the first resin layer; wherein the conductor foil is in contact with one of the second resin layers; and another one of the second resin layers is in contact with a surface opposite to that of the conductor foil in the first resin layer; further comprising forming a second protruding portion along a corner portion of the conductor foil embedded in the first resin layer on the another one of the second resin layers. ### Claim 21 A method for manufacturing a stacked body, the method comprising: stacking a second resin layer including a second resin as a main material on a first resin layer including a first resin as a main material; forming a first conductor layer on the first resin layer; attaching a dry film resist onto the first conductor layer; forming an opening in the dry film resist by photolithography; plating and forming a second conductor layer on the opening; peeling off the dry film resist; removing the first conductor layer and the second conductor layer by etching to form a stacked sheet including the first resin layer, the second resin layer, and a conductor pattern; and stacking and heat-pressing a plurality of the stacked sheets to cause at least a portion of the conductor pattern to be embedded in the first resin layer; wherein the conductor pattern is in contact with the second resin layer; and in a cross section in a stacking direction of a stacked body, in a peripheral length of the conductor pattern, a length of a portion at which the conductor pattern is in contact with the first resin layer is larger than a length of a portion in contact with the second resin layer. ### Claim 22 A method for manufacturing a stacked body, the method comprising: stacking two second resin layers including a second resin as a main material on a first resin layer including a first resin as a main material; forming a first conductor layer on the first resin layer; attaching a dry film resist onto the first conductor layer; forming an opening in the dry film resist by photolithography; plating and forming a second conductor layer on the opening; peeling off the dry film resist; removing the first conductor layer and the second conductor layer by etching to form a stacked sheet including the first resin layer, the second resin layer, and a conductor pattern; and stacking and heat-pressing a plurality of the stacked sheets to cause at least a portion of the conductor pattern to be embedded in the first resin layer; wherein the conductor pattern is in contact with one of the second resin layers; and another one of the second resin layers is in contact with a surface opposite to that of the conductor pattern in the first resin layer; further comprising forming a second protruding portion along a corner portion of the conductor pattern embedded in the first resin layer on the another one of the second resin layers.